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Total Products: 76,307
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/A
R7F7016513ABG-C#HC1RenesasIC MCU 32BIT 4MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
411
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R7F7016514ABG-C#AC1
R7F7016514ABG-C#AC1RenesasIC MCU 32BIT 4MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
863
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N/A
R7F7016514ABG-C#BC1RenesasIC MCU 32BIT 4MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
1,099
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R7F7016514ABG-C#HC1
R7F7016514ABG-C#HC1RenesasIC MCU 32BIT 4MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
1,304
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R7F7016523ABG-C#BC1
R7F7016523ABG-C#BC1RenesasIC MCU 32BIT 3MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
364
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R7F7016523ABG-C#HC1
R7F7016523ABG-C#HC1Renesas32BIT MCU RH850/F1KMMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38×10, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
81
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R7F7016533ABG-C#AC1
R7F7016533ABG-C#AC1RenesasIC MCU 32BIT 4MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, FIFO, FlexRay, I2C, LINbus, SENT, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
544K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
531
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R7F7016533ABG-C#BC1
R7F7016533ABG-C#BC1RenesasIC MCU 32BIT 4MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
269
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R7F7016533ABG-C#HC1
R7F7016533ABG-C#HC1RenesasIC MCU 32BIT 4MB FLASH 272FPBGAMicrocontrollers272-FPBGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
272-FPBGA
Package / Case:
272-BGA
693
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R7F7016534ABG-C#AC1
R7F7016534ABG-C#AC1RenesasIC MCU 32BIT 4MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
1,254
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R7F7016534ABG-C#BC1
R7F7016534ABG-C#BC1RenesasIC MCU 32BIT 4MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
1,005
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R7F7016534ABG-C#HC1
R7F7016534ABG-C#HC1RenesasIC MCU 32BIT 4MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
1,098
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R7F7016843AFD-C#BA1N/AR7F7016843AFD-C#BA1RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
230
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R7F7016843AFD-C#KA1N/AR7F7016843AFD-C#KA1RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
19
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R7F7016843AFE-C#BA1N/AR7F7016843AFE-C#BA1RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
840
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R7F7016843AFE-C#KA1N/AR7F7016843AFE-C#KA1RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
145
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R7F7016843AFP-C#AA1
R7F7016843AFP-C#AA1RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
653
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R7F7016843AFP-C#BA1
R7F7016843AFP-C#BA1RenesasIC MCU 32BIT 3MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,022
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R7F7016843AFP-C#KA1N/AR7F7016843AFP-C#KA1RenesasIC MCU 32BIT 1MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
861
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QUOTE
R7F7016844AFD-C#BA1N/AR7F7016844AFD-C#BA1RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,939
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QUOTE

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