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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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UPD70F3357GJ(A)-GAE-E2-AXN/AUPD70F3357GJ(A)-GAE-E2-AXRenesasIC MCU 32BIT 768KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,863
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UPD70F3357GJ(A)-GAE-E2-QS-AXN/AUPD70F3357GJ(A)-GAE-E2-QS-AXRenesasIC MCU 32BIT 768KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
592
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UPD70F3357GJ(A)-GAE-QS-AXN/AUPD70F3357GJ(A)-GAE-QS-AXRenesasIC MCU 32BIT 768KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
870
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UPD70F3358GJ(A)-GAE-AX
UPD70F3358GJ(A)-GAE-AXRenesas32BIT MCU V850ES/SJ3 1M 1CANMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
712
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UPD70F3364GJ(A)-GAE-E2-DE-AXN/AUPD70F3364GJ(A)-GAE-E2-DE-AXRenesasIC MCU 32BIT 384KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
648
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UPD70F3364GJ(A)-GAE-QS-AXN/AUPD70F3364GJ(A)-GAE-QS-AXRenesasIC MCU 32BIT 384KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,582
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UPD70F3364GJ(A9)-GAE-E2-QS-AXN/AUPD70F3364GJ(A9)-GAE-E2-QS-AXRenesasIC MCU 32BIT 384KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
587
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UPD70F3366GJ(A)-GAE-AX
UPD70F3366GJ(A)-GAE-AXRenesas32BIT MCU V850ES/SX3Microcontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
392
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UPD70F3368GJ(A)-GAE-AX
UPD70F3368GJ(A)-GAE-AXRenesas32BIT MCU V850ES/SJ3 1M 2CANMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
319
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UPD70F3368GJ(A)-GAE-E2-AXN/AUPD70F3368GJ(A)-GAE-E2-AXRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
323
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QUOTE
UPD70F3370AM1GBA-GAH-AX
UPD70F3370AM1GBA-GAH-AXRenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,201
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UPD70F3370AM1GBA-GAH-E2-QS-AXN/AUPD70F3370AM1GBA-GAH-E2-QS-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
341
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UPD70F3370AM2GBA-GAH-AX
UPD70F3370AM2GBA-GAH-AXRenesas32BIT MCU V850ES/FX3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
665
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QUOTE
UPD70F3370AM2GBA-GAH-E2-AXN/AUPD70F3370AM2GBA-GAH-E2-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
395
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QUOTE
UPD70F3370AM2GBA-GAH-E3-QS-AX
UPD70F3370AM2GBA-GAH-E3-QS-AXRenesas32BIT MCU V850ES/FE2 128KMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
455
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QUOTE
UPD70F3370AM2GBA-GAH-QS-AXN/AUPD70F3370AM2GBA-GAH-QS-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
461
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QUOTE
UPD70F3370AM2GBA1-GAH-E2-AXN/AUPD70F3370AM2GBA1-GAH-E2-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
809
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QUOTE
UPD70F3370AM2GBA1-GAH-E2-QS-AXN/AUPD70F3370AM2GBA1-GAH-E2-QS-AXRenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
66
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QUOTE
UPD70F3370AM2GBA1-GAH-E3-QS-AXN/AUPD70F3370AM2GBA1-GAH-E3-QS-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
496
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QUOTE
UPD70F3370AM2GBA2-GAH-AXN/AUPD70F3370AM2GBA2-GAH-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
24MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,129
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QUOTE

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