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Total Products: 76,308
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
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DSPIC33EP32MC504T-I/MLDSPIC33EP32MC504T-I/MLMicrochip TechnologyIC MCU 16BIT 32KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
32KB (10.7K x 24)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 9x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
720
DSPIC33EP32MC504T-I/MVDSPIC33EP32MC504T-I/MVMicrochip TechnologyIC MCU 16BIT 32KB FLASH 48UQFNMicrocontrollers48-UQFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
32KB (10.7K x 24)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 9x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-UQFN (6×6)
Package / Case:
48-UFQFN Exposed Pad
409
DSPIC33EP32MC504T-I/PTDSPIC33EP32MC504T-I/PTMicrochip TechnologyIC MCU 16BIT 32KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
32KB (10.7K x 24)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 9x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
524
DSPIC33EP32MC504T-I/TLDSPIC33EP32MC504T-I/TLMicrochip TechnologyIC MCU 16BIT 32KB FLASH 44VTLAMicrocontrollers44-VTLA (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
32KB (10.7K x 24)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 9x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-VTLA (6×6)
Package / Case:
44-VFTLA Exposed Pad
1,172
DSPIC33EP512GM304-E/MLDSPIC33EP512GM304-E/MLMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
1,057
DSPIC33EP512GM304-E/PTDSPIC33EP512GM304-E/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
760
DSPIC33EP512GM304-H/MLDSPIC33EP512GM304-H/MLMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
149
DSPIC33EP512GM304-H/PTDSPIC33EP512GM304-H/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
311
DSPIC33EP512GM304-I/MLDSPIC33EP512GM304-I/MLMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
446
DSPIC33EP512GM304-I/PTDSPIC33EP512GM304-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
1,111
DSPIC33EP512GM304T-I/MLDSPIC33EP512GM304T-I/MLMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
855
DSPIC33EP512GM304T-I/PTDSPIC33EP512GM304T-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
569
DSPIC33EP512GM306-E/MRDSPIC33EP512GM306-E/MRMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
265
DSPIC33EP512GM306-E/PTDSPIC33EP512GM306-E/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
724
DSPIC33EP512GM306-H/MRDSPIC33EP512GM306-H/MRMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
582
DSPIC33EP512GM306-H/PTDSPIC33EP512GM306-H/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
686
DSPIC33EP512GM306-I/MRDSPIC33EP512GM306-I/MRMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
627
DSPIC33EP512GM306-I/PTDSPIC33EP512GM306-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
804
DSPIC33EP512GM306T-I/MRDSPIC33EP512GM306T-I/MRMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
283
DSPIC33EP512GM306T-I/PTDSPIC33EP512GM306T-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
417

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