10,000+ Happy Customers
20+ Years in Business
75,000+ SKUs in Stock
80+ Authorized Manufacturers
Helping Tech Companies Create What’s Next!
phoneCall +1.949.783.7300
GET A
QUOTE

Electronic Parts Search

Suntsu Electronics is your reliable source for hard-to-find and obsolete electronic components. Our advanced part search tool makes it easy to quickly find the products you need. You can search by part number, manufacturer, or specifications to instantly access a comprehensive database of electronic components.

Featured Brands

Part Search

CLEAR SEARCH
Total Products: 76,308
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
HD6417706BP133V
HD6417706BP133VRenesasRISC MCU, 133.34MHZMicrocontrollersN/AN/AN/A

N/A

712
GET A
QUOTE
HD6417707RF60A
HD6417707RF60ARenesasIC MCU 32-BIT FLASHMicrocontrollers-N/A–
Core Size:
32-Bit
Program Memory Type:
FLASH
Mounting Type:
Surface Mount
1,542
GET A
QUOTE
HD6417708RF100AV
HD6417708RF100AVRenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, SCI, SmartCard
Peripherals:
POR, WDT
Number of I/O:
8
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
3.15V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
133
GET A
QUOTE
HD6417708SF60
HD6417708SF60RenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
EBI/EMI, SCI, SmartCard
Peripherals:
POR, WDT
Number of I/O:
8
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,267
GET A
QUOTE
HD6417710XVN/AHD6417710XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
445
GET A
QUOTE
HD6417712BPV
HD6417712BPVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
379
GET A
QUOTE
HD6417712XVN/AHD6417712XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
1,541
GET A
QUOTE
N/A
HD6417713BPVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
1,032
GET A
QUOTE
HD6417713XVN/AHD6417713XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
603
GET A
QUOTE
HD6417720BP133CV
HD6417720BP133CVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
FIFO, I2C, IrDA, Memory Card, SCI, SD, SIO, SIM, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
117
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
1,793
GET A
QUOTE
HD6417727BP100CV
HD6417727BP100CVRenesasIC MCU 32BIT ROMLESS 240LFBGAMicrocontrollers240-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
240-LFBGA (13×13)
Package / Case:
240-LFBGA
269
GET A
QUOTE
HD6417727BP160CV
HD6417727BP160CVRenesasIC MCU 32BIT ROMLESS 240LFBGAMicrocontrollers240-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
240-LFBGA (13×13)
Package / Case:
240-LFBGA
156
GET A
QUOTE
HD6417727X100CV
HD6417727X100CVRenesasIC MCU 32BIT ROMLESS 240HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
572
GET A
QUOTE
HD6417727X160CV
HD6417727X160CVRenesasIC MCU 32BIT ROMLESS 240HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
284
GET A
QUOTE
HD6417750BP200M
HD6417750BP200MRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
813
GET A
QUOTE
HD6417750BP200MV
HD6417750BP200MVRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
310
GET A
QUOTE
HD6417750F167
HD6417750F167RenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
1,551
GET A
QUOTE
HD6417750RBP200V
HD6417750RBP200VRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
1,075
GET A
QUOTE
HD6417750RF200DV
HD6417750RF200DVRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
496
GET A
QUOTE
HD6417750RF200V
HD6417750RF200VRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
1,841
GET A
QUOTE

We’ve Got You Covered!

If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


    Global Sourcing Capabilities

    Tap into our global network of suppliers to find the components you need. We simplify procurement, even for hard-to-find parts, saving you time and ensuring smooth production.

    Second Sourcing  Second Sourcing Solutions

    Don’t let supply chain disruptions delay your project. We’ll help you identify alternative components and secure reliable secondary sources to keep your production on track.

    Obsolescence Management  Obsolescence Management

    Outsmart obsolescence and ensure your designs stay in production. We’ll help you navigate component lifecycles, secure long-term supply, and find smart alternatives when parts are discontinued.

    Shortage Mitigation  Shortage Mitigation

    Forget supply chain worries. Our team specializes in navigating the unpredictable component market, leveraging our global network and deep expertise to help you find the necessary components when you need them.

























      I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


      keyboard_arrow_up