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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8358ECZQAGDGAMPC8358ECZQAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
907
MPC8358EVRADDDAMPC8358EVRADDDANXP SemiconductorsIC MPU MPC83XX 266MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
210
MPC8358EVRAGDDAMPC8358EVRAGDDANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
299
MPC8358EVRAGDGAMPC8358EVRAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
1,296
MPC8358EVVAGDGAMPC8358EVVAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
82
MPC8358EZQADDDAMPC8358EZQADDDANXP SemiconductorsIC MPU MPC83XX 266MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
581
MPC8358EZQAGDDAMPC8358EZQAGDDANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
102
MPC8358EZQAGDGAMPC8358EZQAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
783
N/AMPC8358VRADDDANXP SemiconductorsIC MPU MPC83XX 266MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
81
MPC8358VRAGDDAMPC8358VRAGDDANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
733
MPC8358VRAGDGAMPC8358VRAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
395
MPC8358VVADDEAMPC8358VVADDEANXP SemiconductorsIC MPU MPC83XX 266MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
1,535
MPC8358VVAGDGAMPC8358VVAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
740-LBGA
Supplier Device Package:
740-TBGA (37.5×37.5)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
55
MPC8358ZQADDDAMPC8358ZQADDDANXP SemiconductorsIC MPU MPC83XX 266MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
8
MPC8358ZQAGDDAMPC8358ZQAGDDANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
527
MPC8358ZQAGDGAMPC8358ZQAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
239
MPC8360CVVAGDGAMPC8360CVVAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
198
MPC8360CVVAJDGAMPC8360CVVAJDGANXP SemiconductorsIC MPU MPC83XX 533MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Mounting Type:
Surface Mount
1,594
MPC8360CZUAJDGAMPC8360CZUAJDGANXP SemiconductorsIC MPU MPC83XX 533MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Mounting Type:
Surface Mount
1,387
MPC8360ECVVAGDGAMPC8360ECVVAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
260

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