MPC8360ECVVAGDGA

IC MPU MPC83XX 400MHZ 740TBGA
Part Description

PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 740-TBGA (37.5x37.5)

Quantity 941 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300Device Package740-TBGA (37.5x37.5)Mounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C – 105°CPackage / CaseTray
Speed400MHzVoltage1.8V, 2.5V, 3.3V

Overview of MPC8360ECVVAGDGA – PowerPC e300 400 MHz Embedded Communications Processor

The MPC8360ECVVAGDGA is a PowerPC e300-based microprocessor from the MPC8360 series, delivering a single 32-bit core running at 400 MHz. It is offered in a 740-TBGA (37.5×37.5 mm) surface-mount package and is qualified for industrial applications.

Designed as a cost-effective, highly integrated communications processor, the device targets networking, wireless infrastructure, and telecommunications systems. The architecture emphasizes higher CPU performance, expanded functionality, faster interfaces, and robust interworking to address control-plane and data-plane requirements in embedded communications designs.

Key Features

  • Core Single PowerPC e300 core operating at 400 MHz with a 32-bit execution environment.
  • Cache e300 core includes 32 Kbytes of instruction cache and 32 Kbytes of data cache for improved instruction and data throughput.
  • QUICC Engine Integrated QUICC Engine module providing termination, interworking, and switching functionality between protocols for communications processing.
  • High-speed Interfaces and Peripherals On-chip subsystems listed in the device documentation include DDR/DDR2 memory interfaces, UCC Ethernet controller (three-speed Ethernet), PCI, USB, I2C, SPI, JTAG, GPIO, timers, DUART, and HDLC/serial controllers.
  • Memory Support Documentation references DDR and DDR2 SDRAM support for system memory configurations.
  • Package and Mounting Supplier device package: 740-TBGA (37.5×37.5 mm); surface-mount mounting type; shipped in tray format.
  • Qualification Industrial qualification specified in the product data.

Typical Applications

  • DSLAMs and Access Equipment Used in next-generation DSL access multiplexers where integrated communications processing and protocol interworking are required.
  • Wireless Infrastructure Appropriate for network interface cards in 3G base stations (Node Bs), providing control-plane and data-plane functionality.
  • Routers and Media Gateways Deployed in routing and media gateway applications that require integrated Ethernet, PCI, and serial protocol support.
  • Integrated Access Devices (IADs) Suitable for high-end IADs that need combined protocol termination, interworking, and switching capabilities.

Unique Advantages

  • Highly integrated communications processor: Combines a PowerPC e300 core with a QUICC Engine and a broad set of peripherals to reduce external components and simplify board design.
  • Balanced CPU and I/O capabilities: 400 MHz single-core performance paired with on-chip Ethernet, PCI, USB, and memory interfaces supports mixed control- and data-plane workloads.
  • Protocol interworking built in: The QUICC Engine provides termination, interworking, and switching between protocols, reducing firmware overhead for communications tasks.
  • Documented platform: Detailed reference documentation and datasheet material are available for system design and integration.
  • Industrial qualification: Specified for industrial use, making it suitable for embedded deployments in networking and telecom environments.
  • Compact TBGA package: 740-TBGA (37.5×37.5 mm) package enables dense board-level integration for space-constrained systems.

Why Choose MPC8360ECVVAGDGA?

The MPC8360ECVVAGDGA positions itself as a focused communications processor combining the PowerPC e300 core with a dedicated QUICC Engine and an extensive peripheral set. Its 400 MHz core speed, integrated caches, and documented support for DDR/DDR2 and multiple I/O subsystems make it appropriate for embedded networking, wireless infrastructure, and telecommunications equipment requiring both control-plane and data-plane capabilities.

This part is suited to design teams seeking a documented, industrially qualified processor platform that reduces external component count while providing the interfaces and protocol handling required for DSLAMs, base station interface cards, routers, media gateways, and high-end IADs.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC8360ECVVAGDGA for your next embedded communications design.

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