MPC8360ECVVAJDG

IC MPU MPC83XX 533MHZ 740TBGA
Part Description

PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 533MHz 740-TBGA (37.5x37.5)

Quantity 113 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300Device Package740-TBGA (37.5x37.5)Mounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C – 105°CPackage / CaseTray
Speed533MHzVoltage1.8V, 2.5V, 3.3V

Overview of MPC8360ECVVAJDG – IC MPU MPC83XX 533MHz 740-TBGA

The MPC8360ECVVAJDG is a PowerPC e300-based microprocessor in the MPC8360 series, operating at 533 MHz. It is a cost-effective, highly integrated communications processor designed for networking and telecommunications applications.

Built for control-plane and data-plane tasks, the device delivers an integrated set of interfaces and a QUICC Engine for protocol termination, interworking and switching, addressing needs in networking, wireless infrastructure and telecom equipment.

Key Features

  • Core Architecture  PowerPC e300 core, single 32-bit core with on-chip instruction and data caches (32 KB each) compatible with the Power Architecture™ 603e instruction set.
  • Performance  533 MHz operating frequency for control-plane processing and communications tasks.
  • Integrated Communications Engine  QUICC Engine module for protocol termination, interworking and switching between protocols to support robust communications processing.
  • Peripheral and Interface Set  Integrated interfaces and modules documented for the series include UCC Ethernet controller (three-speed Ethernet, MII management), PCI, USB, I2C, SPI, DUART, HDLC, TDM/SI, timers, GPIO, JTAG and local bus support.
  • Memory Support  On-chip caches plus documented support for DDR and DDR2 SDRAM in the series for system memory integration.
  • Package & Mounting  740-TBGA package (37.5 × 37.5 mm), surface-mount, supplied in tray format for volume assembly.
  • Qualification  Industrial qualification suitable for embedded industrial applications.

Typical Applications

  • DSLAMs and Access Equipment  Use the integrated communications features and QUICC Engine for protocol handling and packet forwarding in access-network equipment.
  • 3G/Cellular Base Station Interface Cards (Node B)  Employed in network interface cards where control-plane processing and robust protocol interworking are required.
  • Routers and Switches  Acts as a control-plane processor with integrated Ethernet and peripheral support for routing and management functions.
  • Media Gateways and IADs  Provides integrated interfaces and processing for media termination and gateway functions in telecommunications systems.

Unique Advantages

  • Highly integrated communications processor: Combines the e300 core, QUICC Engine and a broad peripheral set to reduce external components and simplify system design.
  • Protocol interworking capability: QUICC Engine supports termination and switching between protocols, enabling robust interworking in telecom and networking equipment.
  • Industrial-grade qualification: Rated for industrial use to meet embedded application requirements in demanding environments.
  • Compact, assembly-ready package: 740-TBGA (37.5×37.5 mm) surface-mount package provides high pin density for complex system integration while supporting tray supply for production.
  • Established vendor and series support: Part of the MPC8360 family from NXP Semiconductors, with documented reference material and an extensive series datasheet to guide system design.

Why Choose MPC8360ECVVAJDG?

The MPC8360ECVVAJDG positions itself as a single-core PowerPC e300 microprocessor tailored for communication-centric embedded systems that require an integrated peripheral set and protocol interworking. Its 533 MHz core, on-chip caches, QUICC Engine and comprehensive interface set make it suitable for designs that balance control-plane processing and data-plane tasks.

This device is aimed at engineers and system designers building industrial and telecom/networking equipment such as DSLAMs, interface cards for base stations, routers and media gateways, where integration, documented architecture and a mature silicon family help reduce design risk and accelerate time-to-market.

Request a quote or submit an inquiry for MPC8360ECVVAJDG to receive pricing, availability and delivery details.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up