XCKU11P-2FFVE1517E

The XCKU11P-2FFVE1517E is a Kintex® UltraScale+™ field programmable gate array (FPGA) supplied in a 1517-FCBGA package. It provides high logic capacity and substantial on-chip memory combined with a 512-pin I/O footprint for designs that require significant programmable logic and I/O density.

With an extended-grade operating range and a defined core supply window, this device is intended for applications that need large embedded memory, extensive I/O, and a compact surface-mount FCBGA package.

Key Features

• Logic Capacity  Approximately 653,100 logic elements and 37,320 configurable logic blocks (CLBs) to implement complex digital designs.
• Embedded Memory  Approximately 53.96 Mbits of on-chip RAM for large buffering, state storage, and data processing functions.
• I/O  512 user I/O pins to support high pin-count interfaces and multi-channel connectivity.
• Power  Core supply range specified at 825 mV to 876 mV for defined power planning and regulation.
• Package and Mounting  1517-BBGA / 1517-FCBGA (40×40) surface-mount package suitable for compact board-level integration.
• Temperature and Grade  Extended grade device with an operating temperature range of 0°C to 100°C for thermally constrained environments.
• RoHS Compliance  RoHS-compliant construction to support lead-free assembly processes.

Typical Applications

• High-density digital designs  Leverage the device's large logic element count and CLB resources to implement complex custom logic and state machines.
• Memory-intensive functions  Use the approximately 53.96 Mbits of embedded RAM for buffering, packet storage, or on-chip data manipulation.
• I/O-heavy systems  Deploy the 512 I/O pins for multi-channel interfaces, parallel buses, or diverse connectivity requirements.

Unique Advantages

• High logic density: Approximately 653,100 logic elements enable consolidation of large functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53.96 Mbits of embedded RAM support large buffers and local data processing without external memory.
• Extensive I/O: 512 user I/O pins provide flexibility for multiple interfaces and parallel connections.
• Compact FCBGA package: The 1517-FCBGA (40×40) surface-mount package allows dense board integration while maintaining high pin counts.
• Defined power window: Core voltage range of 825 mV to 876 mV simplifies power-supply selection and regulation design.
• Extended operating range: Rated for 0°C to 100°C operation to match a variety of deployment environments.

Why Choose XCKU11P-2FFVE1517E?

The XCKU11P-2FFVE1517E combines a large complement of logic elements, significant embedded RAM, and a 512-pin I/O footprint in a 1517-FCBGA surface-mount package, making it suitable for designs that require dense programmable logic and substantial on-chip memory. Its defined core voltage range and extended-grade operating temperature provide clear parameters for power and thermal design.

This part is a fit for teams building high-density, I/O-rich FPGA-based systems that benefit from consolidating functionality on a single device while maintaining predictable electrical and thermal requirements.

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