XCKU11P-3FFVD900E

The XCKU11P-3FFVD900E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 900‑ball FCBGA package (900‑BBGA). It delivers a high count of programmable logic resources and embedded memory in a compact, surface‑mount form factor.

With 653,100 logic elements, approximately 54 Mbits of embedded memory, 408 I/O pins and an extended grade operating range, this device is suited for designs that require dense programmable logic, significant on‑chip storage and substantial I/O integration while operating within a defined supply voltage window.

Key Features

• Core Logic  653,100 logic elements for implementing complex digital logic and programmable architectures.
• Embedded Memory  Approximately 54 Mbits of on‑chip RAM to support buffering, lookup tables and state storage without immediate dependence on external memory.
• I/O Capability  408 user I/O pins to accommodate broad peripheral, sensor and interface connectivity.
• Package & Mounting  900‑FCBGA (31×31) package case designed for surface‑mount PCB assembly to enable high‑density board layouts.
• Power  Specified supply voltage range of 873 mV to 927 mV for core power planning and regulator selection.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in environments matching that profile.
• Regulatory Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom digital processing  Implement complex, application‑specific logic functions using the device's 653,100 logic elements and embedded memory resources.
• High‑density I/O interfacing  Leverage 408 I/O pins for designs requiring numerous external connections, parallel interfaces or multi‑channel signaling.
• On‑chip buffering and lookup  Use approximately 54 Mbits of embedded RAM for data buffering, look‑up tables and intermediate storage to reduce reliance on external memory.
• Platform integration and prototyping  Surface‑mount 900‑FCBGA packaging supports compact, high‑pin‑count board designs and system prototypes.

Unique Advantages

• High logic density: 653,100 logic elements allow consolidation of multiple functions into a single programmable device, reducing BOM complexity.
• Substantial embedded memory: Approximately 54 Mbits of on‑chip RAM provides local storage for buffering and state data, simplifying system memory architecture.
• Large I/O complement: 408 I/Os support extensive external connectivity for multi‑channel interfaces and complex peripheral sets.
• Compact, high‑pin package: 900‑FCBGA (31×31) enables dense PCB routing and saves board area compared with multiple discrete devices.
• Defined power envelope: A clear core voltage window (873 mV–927 mV) assists in precise power supply design and regulation choices.
• Extended operating range: 0 °C–100 °C rating and extended grade classification make the device suitable for deployments requiring that thermal profile.

Why Choose XCKU11P-3FFVD900E?

The XCKU11P-3FFVD900E combines high logic capacity, significant embedded memory and a large I/O count in a compact 900‑ball FCBGA package, making it a strong option for designs that require dense programmable logic and extensive interfacing. Its defined supply voltage range and extended temperature grade help designers plan power and thermal budgets with precision.

As a member of the Kintex® UltraScale+™ family from AMD, this FPGA is suited to engineers and procurement teams seeking a scalable, high‑density programmable device for system integration, prototyping and deployment within the specified electrical and thermal limits.

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