XCKU11P-L1FFVD900I

The XCKU11P-L1FFVD900I is an AMD Kintex® UltraScale+™ field programmable gate array (FPGA) supplied in a 900-ball FCBGA package. It provides a high-density programmable logic fabric combined with substantial embedded memory and a large count of I/O suitable for industrial-grade applications.

With 653,100 logic elements, approximately 54 Mbits of on-chip RAM and 408 I/O pins, this device targets designs that require high integration, reconfigurable logic capacity and operation across an industrial temperature range.

Key Features

• Logic Capacity  653,100 logic elements to implement complex, high-density digital designs.
• Embedded Memory  Approximately 54 Mbits of on-chip RAM (53,964,800 bits) for buffering, state storage and data-path implementations.
• I/O Density  408 I/O pins to support wide parallel interfaces and multiple external connections.
• Power Supply  Operates from a supply range of 698 mV to 876 mV, enabling compatibility with supported core power architectures.
• Package and Mounting  900-ball FCBGA (31 × 31) package, surface-mount mounting type for compact, high-pin-count board designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Manufacturer  Designed and produced by AMD.
• Standards Compliance  RoHS compliant.

Typical Applications

• Industrial Automation and Control  Use the industrial-grade temperature range and high I/O count for control logic, real-time interfacing and system orchestration.
• High-Density Logic and Data Processing  Employ the large logic element count and embedded RAM for complex digital signal processing, custom acceleration or algorithm implementation.
• Interface Aggregation and Bridging  Leverage 408 I/O pins to consolidate multiple external interfaces or implement high-pin-count protocol bridging on a single device.

Unique Advantages

• High Integration Density: 653,100 logic elements enable consolidation of multiple functions into a single FPGA, reducing overall system BOM.
• Substantial On-Chip Memory: Approximately 54 Mbits of embedded RAM supports large buffers and stateful logic without external memory.
• Extensive I/O Connectivity: 408 I/O pins provide flexibility for parallel interfaces, sensors, actuators and external peripherals.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the demands of industrial environments.
• Compact High-Pin-Count Package: 900-FCBGA (31×31) package offers a small footprint with high pin density for space-constrained boards.
• Regulatory Compliance: RoHS compliant for environmental and manufacturing process compatibility.

Why Choose XCKU11P-L1FFVD900I?

The XCKU11P-L1FFVD900I positions itself as an industrial-grade, high-density FPGA solution for designs requiring substantial logic resources, embedded memory and broad I/O connectivity. Its combination of 653,100 logic elements, approximately 54 Mbits of on-chip RAM and 408 I/O pins enables consolidation of complex interfaces and data processing into a single reconfigurable device.

This AMD Kintex® UltraScale+™ FPGA is suited to engineers and system designers developing industrial control, high-density logic implementations or interface aggregation solutions who require long-term robustness, compact high-pin-count packaging and compliance with RoHS requirements.

Request a quote or submit a pricing inquiry for the XCKU11P-L1FFVD900I to evaluate availability and delivery for your next design.