XCKU11P-L1FFVE1517I

The XCKU11P-L1FFVE1517I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC designed for industrial applications requiring high-density programmable logic and flexible I/O. It combines a large logic fabric with substantial on-chip memory and a 1517-ball FCBGA package for compact board-level integration.

This device targets designs that need significant logic capacity and configurable interfaces while operating across an industrial temperature range and low-voltage supply window.

Key Features

• Logic Capacity — 653,100 logic elements provide the programmable resources needed for complex digital functions and custom accelerators.
• Embedded Memory — Approximately 54 Mbits of embedded memory available on-chip to support buffering, caching, and state storage.
• I/O Count — 512 programmable I/O pins enable numerous high-density interfaces and peripheral connections.
• Package — 1517-BBGA / 1517-FCBGA package (supplier device package: 1517-FCBGA, 40×40) suitable for surface-mount assemblies.
• Power Supply Range — Operates from 698 mV to 876 mV, supporting designs targeting low-voltage core operation.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Mounting — Surface mount device for standard PCB assembly processes.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory adherence.

Typical Applications

• Industrial Control — Implement motor control, PLC logic, and custom automation functions leveraging high logic density and extended temperature range.
• Communications Infrastructure — Deploy programmable interfaces and packet-processing logic using the device’s large logic and I/O resources.
• Test and Measurement — Build configurable signal processing and timing functions that benefit from on-chip memory and abundant logic elements.
• Embedded Processing and Acceleration — Integrate custom accelerators and hardware offloads using the FPGA’s logic fabric and embedded RAM.

Unique Advantages

• High Logic Density: 653,100 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 54 Mbits of embedded memory supports large buffers and stateful processing without relying solely on external memory.
• Extensive I/O: 512 I/O pins allow for numerous peripheral connections and flexible interface routing on finished PCBs.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for demanding environmental conditions.
• Compact, Surface-Mount Package: 1517-FCBGA (40×40) package enables high-density board layouts while maintaining robust interconnect.
• Low-Voltage Core Operation: Support for 698 mV to 876 mV supply voltages fits power-conscious designs that require reduced core voltages.

Why Choose XCKU11P-L1FFVE1517I?

The XCKU11P-L1FFVE1517I positions itself as a high-capacity, industrial-grade FPGA option for designs that need a balance of logic resources, embedded memory, and extensive I/O in a compact FCBGA package. Its specifications make it suitable for engineers consolidating multiple functions, implementing custom accelerators, or building configurable interfaces in industrial and infrastructure equipment.

Choosing this device provides a scalable hardware platform anchored by significant on-chip resources, industrial temperature support, and a surface-mount 1517-FCBGA footprint for streamlined integration into production hardware.

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