XCKU11P-L2FFVA1156E

The XCKU11P-L2FFVA1156E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers a high logic capacity FPGA fabric with integrated on-chip memory and a large I/O count in a 1156-ball FCBGA package for surface-mount applications.

With 653,100 logic elements, approximately 54 Mbits of embedded memory and 464 I/Os, this extended-grade device supports designs that require substantial logic density, on-chip storage and multi-pin interfacing while operating within a 0 °C to 100 °C temperature range and a supply range of 698 mV to 876 mV. The device is RoHS compliant.

Key Features

• Core Logic  653,100 logic elements provide large-scale programmable logic capacity for complex designs.
• Embedded Memory  Approximately 54 Mbits of on-chip RAM to support buffering, lookup tables and local storage without relying solely on external memory.
• I/O Density  464 general-purpose I/Os enable high channel counts and wide parallel interfacing to peripherals and subsystems.
• Package & Mounting  1156-FCBGA (35×35) package in a surface-mount form factor for compact board-level integration.
• Power  Supported core supply range from 698 mV to 876 mV for power-domain planning and system-level power budgeting.
• Temperature & Grade  Extended-grade device rated for operation from 0 °C to 100 °C.
• Compliance  RoHS compliant, helping meet environmental and regulatory requirements for lead-free assembly.

Typical Applications

• High-channel digital I/O systems  Systems that need to manage many parallel signals can leverage the 464 I/Os for interface aggregation and multiport connectivity.
• Logic-dense processing  Designs requiring substantial programmable logic capacity can use the 653,100 logic elements to implement complex state machines, datapaths and custom processing blocks.
• On-chip buffering and storage  Applications that benefit from embedded memory can take advantage of approximately 54 Mbits of on-chip RAM for local buffering and temporary data storage.
• Board-level integration  The 1156-FCBGA (35×35) surface-mount package supports compact PCB layouts where high pin-count FPGAs are needed.

Unique Advantages

• High integration density:  653,100 logic elements and substantial embedded RAM reduce the need for multiple discrete components for logic and local storage.
• Large I/O capability:  464 I/Os simplify interfacing to multiple peripherals, sensors and high-channel-count systems without extensive external multiplexing.
• Compact package:  1156-FCBGA (35×35) delivers a high-pin-count solution in a compact surface-mount footprint for space-constrained designs.
• Design thermal envelope clarity:  Extended-grade rating with a specified operating range of 0 °C to 100 °C helps define thermal management and qualification boundaries.
• Controlled power domain:  A defined supply range (698 mV to 876 mV) assists in precise power-supply planning and board-level design.
• RoHS compliance:  Meets lead-free environmental requirements for modern assembly processes.

Why Choose XCKU11P-L2FFVA1156E?

The XCKU11P-L2FFVA1156E positions itself as a high-capacity Kintex® UltraScale+™ FPGA for designs that require substantial programmable logic, significant embedded memory and broad I/O capability in a compact FCBGA package. Its extended-grade rating and defined supply and temperature ranges make it suitable for applications that need clear electrical and thermal operating parameters.

Designed and manufactured by AMD, this device is intended for engineering teams and procurement seeking a high-density FPGA solution with on-chip resources for buffering and logic, a high pin count for interfacing, and RoHS compliance for lead-free assembly workflows.

Request a quote or submit an inquiry for the XCKU11P-L2FFVA1156E to receive pricing and availability information tailored to your project requirements.