XCKU11P-L1FFVA1156I

The XCKU11P-L1FFVA1156I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD designed for industrial-grade programmable logic applications. It offers high logic density, substantial embedded memory, and a large I/O count in a 1156-FCBGA (35×35) surface-mount package, suited for systems that require compact, reconfigurable digital processing within an industrial temperature range.

Key Features

• Core Logic — Approximately 653,100 logic elements provide capacity for complex custom logic, algorithm implementation, and large-scale digital designs.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM (53,964,800 bits) for buffering, lookup tables, and local data storage to support high-throughput designs.
• I/O Density — 464 I/O pins enable wide external device interfacing and flexible system integration.
• Power Range — Voltage supply range from 698 mV to 876 mV to match system power-rail design requirements.
• Package & Mounting — 1156-BBGA / 1156-FCBGA package (35×35) with surface-mount construction for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet elevated-environment deployment needs.
• Compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Industrial Automation — Implement complex control logic, signal processing, and custom protocol handling within industrial equipment, leveraging the industrial temperature rating and high logic capacity.
• High-density Custom Logic — Deploy large-scale programmable architectures and data-paths that require approximately 653,100 logic elements and significant embedded RAM.
• System Integration — Integrate multiple peripherals and subsystems using 464 general-purpose I/O for flexible board-level connectivity.

Unique Advantages

• High Logic Capacity: Approximately 653,100 logic elements enable implementation of sizable custom architectures without immediate partitioning across devices.
• Substantial On-chip Memory: Around 54 Mbits of embedded RAM supports local buffering and fast-access data storage to reduce external memory dependency.
• Large I/O Count: 464 I/O signals simplify interfacing to sensors, actuators, and peripheral controllers, reducing the need for external I/O expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to support deployment in harsher environments common in industrial systems.
• Compact FCBGA Package: 1156-FCBGA (35×35) surface-mount package enables high-density implementations while maintaining board-space efficiency.
• Regulatory Alignment: RoHS compliance streamlines manufacturing and end-product regulatory processes.

Why Choose XCKU11P-L1FFVA1156I?

The XCKU11P-L1FFVA1156I positions itself as a high-density, industrial-grade FPGA option within the Kintex® UltraScale+™ family, delivering a balance of large programmable logic capacity, significant on-chip RAM, and extensive I/O in a compact FCBGA footprint. Its voltage and temperature ratings make it suitable for engineers developing robust, reconfigurable systems that require sustained operation in demanding environments.

Choose this part when your design requires headroom for complex algorithms, substantial embedded memory, and broad external interfacing while maintaining industrial temperature capability and RoHS compliance.

Request a quote or submit a pricing inquiry to evaluate XCKU11P-L1FFVA1156I availability and lead time for your next industrial FPGA design.