XCKU11P-2FFVE1517I

The XCKU11P-2FFVE1517I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD designed for applications that require large programmable logic capacity, sizable embedded memory, and a high I/O count. This device is supplied in a 1517-FCBGA package and is intended for surface-mount assembly.

Key characteristics include 653,100 logic elements, approximately 54 Mbits of embedded memory, 512 user I/O, an industrial operating temperature range, and a low-voltage core supply range. These attributes make the device suitable for designs that need dense logic, extensive on-chip RAM, and broad environmental tolerance.

Key Features

• Logic Capacity — 653,100 logic elements provide a large fabric for implementing complex programmable logic and custom digital functions.
• Configurable Logic Blocks — 37,320 CLBs enable organized distribution of logic resources across the device.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM allow for significant local buffering, FIFOs, and memory-intensive algorithms without external memory.
• I/O Density — 512 I/O pins support numerous high-density interfaces and parallel connectivity options.
• Power Supply Range — Core voltage supply specified from 825 mV to 876 mV for devices and designs that require precise low-voltage operation.
• Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) package in a surface-mount format for high-density PCB integration.
• Thermal & Environmental — Industrial grade with an operating temperature range of −40 °C to 100 °C for use in environments with extended temperature requirements.
• Regulatory Compliance — RoHS compliant to meet common environmental and material-safety requirements.

Typical Applications

• Programmable logic systems — Designs that require large logic capacity and flexible hardware implementation can leverage the device’s 653,100 logic elements and 37,320 CLBs.
• Memory‑intensive designs — Applications needing significant on-chip buffering or local storage can use the approximately 54 Mbits of embedded memory to reduce external memory dependence.
• High‑I/O interface implementations — Systems requiring many parallel or discrete signals can utilize the 512 available I/O pins for dense connectivity.

Unique Advantages

• Large programmable fabric: 653,100 logic elements provide the capacity for complex logic, custom datapaths, and extensive IP integration.
• Substantial on‑chip memory: Approximately 54 Mbits of embedded RAM supports data buffering, algorithmic storage, and reduced external memory requirements.
• High I/O count: 512 I/O pins enable multiple parallel interfaces and high-density system connections without additional bridging logic.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in thermally demanding or outdoor environments.
• Compact, surface‑mount package: 1517-FCBGA (40×40) offers a high-pin-count solution in a footprint suited for modern PCB assembly.
• RoHS compliant: Meets lead-free and restricted-material requirements for easier regulatory alignment.

Why Choose XCKU11P-2FFVE1517I?

The XCKU11P-2FFVE1517I positions a large Kintex® UltraScale+™ FPGA fabric, extensive embedded memory, and a high I/O complement within an industrial-grade, surface-mount 1517-FCBGA package. Its voltage and temperature specifications make it suitable for designs that require precise low-voltage core operation and extended operating temperature capability.

This device is appropriate for engineers and procurement teams seeking a high-capacity, RoHS-compliant FPGA from AMD for complex, high-density programmable logic designs that benefit from significant on-chip RAM and a large number of I/O pins.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XCKU11P-2FFVE1517I. Include your quantity and lead-time requirements to expedite a response.