XCKU11P-2FFVD900E

The XCKU11P-2FFVD900E is an AMD Kintex® UltraScale+™ field programmable gate array provided in a 900‑ball FCBGA package. It delivers a high count of logic elements, substantial on-chip memory, and a broad I/O complement for dense, programmable digital implementations.

This surface-mount FPGA is supplied in a 900‑BBGA/FCBGA (31×31) package, operates from 825 mV to 876 mV core supply, and is specified for operation from 0°C to 100°C with an Extended grade and RoHS compliance.

Key Features

• Logic Capacity — 653,100 logic elements to implement complex custom logic and high-density designs.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Resources — 408 I/O pins to support extensive peripheral and interface connectivity needs.
• Package & Mounting — 900‑FCBGA (31×31) / 900‑BBGA package designed for surface-mount assembly.
• Power Supply — Core supply range of 825 mV to 876 mV to match system power rails and design constraints.
• Operating Range & Grade — Specified operating temperature from 0°C to 100°C and listed as Extended grade for broader application environments.
• Compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• High‑density programmable logic — Implement large-scale custom digital functions where substantial logic capacity and embedded memory are required.
• Data processing and buffering — Use the approximately 54 Mbits of on-chip RAM for local data storage, packet buffering, or intermediate processing.
• I/O‑intensive systems — Leverage 408 I/O pins to connect multiple peripherals, interfaces, or parallel buses.

Unique Advantages

• High logic count: 653,100 logic elements enable the implementation of complex algorithms and large custom logic blocks without external ASICs.
• Substantial on‑chip memory: Approximately 54 Mbits of RAM reduce dependence on external memory for many buffering and state‑storage tasks.
• Robust I/O capacity: 408 I/Os provide flexibility to integrate multiple interfaces and sensors directly to the FPGA fabric.
• Compact, production-ready package: 900‑FCBGA (31×31) surface-mount package supports high‑density board layouts and standard assembly processes.
• Designed for controlled environments: Extended grade and 0°C to 100°C operating range suit deployments where a wider-than-commercial temperature range is required.
• Regulatory alignment: RoHS compliance supports lead-free manufacturing requirements.

Why Choose XCKU11P-2FFVD900E?

The XCKU11P-2FFVD900E positions itself as a high-capacity Kintex® UltraScale+™ FPGA option for designers who require a combination of extensive logic resources, significant embedded memory, and a large I/O complement in a 900‑ball FCBGA package. Its Extended grade and 0°C–100°C operating range provide flexibility for a range of deployment environments while maintaining RoHS compliance.

This device is suited to engineering teams building dense, programmable digital systems that need on-chip memory and broad connectivity in a compact surface-mount form factor.

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