XCKU11P-1FFVE1517I

The XCKU11P-1FFVE1517I is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, delivered in a 1517-FCBGA (40×40) surface-mount package. It provides 653,100 logic elements, approximately 54 Mbits of embedded memory, and 512 general-purpose I/O pins.

Specified for industrial operation, this device supports a supply voltage range of 825 mV to 876 mV and an operating temperature range of -40 °C to 100 °C, making it suitable for designs that require high logic density, significant on-chip memory, and broad I/O capacity.

Key Features

• Core Logic 653,100 logic elements available for implementing complex programmable logic and custom datapaths.
• Embedded Memory Approximately 54 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O Capacity 512 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and dense connectivity requirements.
• Package & Mounting 1517-FCBGA (40×40) package in a surface-mount form factor for compact board-level integration.
• Power Supported supply voltage from 825 mV to 876 mV for predictable core-power planning.
• Temperature & Grade Industrial grade device specified for operation from -40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density compute and signal processing Implement complex algorithms and custom accelerators using the device's large logic element count and embedded RAM.
• Connectivity and interface aggregation Use 512 I/O pins to support multiple parallel interfaces, bridging functions, and high-pin-count I/O requirements.
• Industrial control and automation Industrial-grade temperature range and robust on-chip resources suit deployment in factory and process-control environments.

Unique Advantages

• High logic capacity: 653,100 logic elements enable large-scale, complex programmable designs without immediate need for external logic.
• Substantial on-chip memory: Approximately 54 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-storage tasks.
• Extensive I/O: 512 I/O pins provide design flexibility for multi-channel and multi-interface systems.
• Industrial-grade operation: -40 °C to 100 °C rating supports a wide operational envelope for demanding environments.
• Compact FCBGA package: 1517-FCBGA (40×40) offers a high-density, surface-mount solution for space-constrained boards.
• Regulatory compliance: RoHS compliance supports environmentally regulated product development.

Why Choose XCKU11P-1FFVE1517I?

The XCKU11P-1FFVE1517I positions itself as a high-density, industrial-grade FPGA option within the Kintex UltraScale+ family, combining extensive logic resources, significant embedded memory, and a large I/O complement in a compact FCBGA package. These attributes make it appropriate for teams designing systems that require substantial on-chip compute and connectivity while maintaining a robust operating temperature range.

For projects that need scalable programmable logic capacity and predictable power and thermal characteristics, this AMD FPGA delivers a balanced platform for integration into industrial and high-performance embedded applications.

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