XCKU11P-1FFVA1156I

The XCKU11P-1FFVA1156I is a Kintex® UltraScale+™ FPGA from AMD designed for high-capacity programmable logic implementations. It provides substantial on-chip logic and memory resources along with a high I/O count in a 1156-FCBGA package, targeted at industrial-grade embedded systems.

With 653,100 logic elements, approximately 54 Mbits of embedded memory and 464 I/O, this device addresses designs that require dense logic integration, significant internal RAM and broad external interfacing while operating across an industrial temperature range.

Key Features

• Core Logic  653,100 logic elements to support complex, high-density programmable logic functions.
• Configurable Logic Blocks  Large resource count enables implementation of sizable custom hardware accelerators and control logic.
• Embedded Memory  Approximately 54 Mbits of on-chip RAM for buffer, queue and working memory needs without relying solely on external memory.
• I/O Capacity  464 I/O pins provide broad connectivity for parallel interfaces, sensor hubs, or multi-channel I/O systems.
• Power  Core supply range of 0.825 V to 0.876 V allowing precise power planning for board designs.
• Packaging & Mounting  Supplied in a 1156-FCBGA (35×35) package for surface-mount assembly and compact board integration.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control Systems  High logic capacity and industrial temperature rating suit complex control, motion and automation applications.
• Data Processing & Acceleration  Large logic and embedded RAM resources enable implementation of hardware accelerators and on-chip buffering for data-centric tasks.
• I/O-Intensive Embedded Systems  464 I/O pins support multi-channel interfaces, sensors and peripheral connectivity in embedded platforms.

Unique Advantages

• High Logic Density:  653,100 logic elements allow consolidation of functions onto a single device, reducing BOM and board complexity.
• Substantial On-Chip Memory:  Approximately 54 Mbits of embedded RAM minimizes external memory dependence and improves data throughput for on-device processing.
• Broad I/O Count:  464 I/O pins provide flexibility to connect multiple peripherals and interfaces without additional bridging devices.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation to meet the demands of industrial deployment environments.
• Compact FCBGA Package:  1156-FCBGA (35×35) enables high-density board layouts while supporting surface-mount assembly processes.
• Regulatory Compliance:  RoHS compliant for straightforward integration into lead-free manufacturing workflows.

Why Choose XCKU11P-1FFVA1156I?

The XCKU11P-1FFVA1156I delivers a balanced combination of large logic capacity, significant embedded memory and extensive I/O in an industrial-grade FPGA package. Its specifications make it suitable for engineers who need to consolidate complex functions, implement on-chip data handling, and interface with numerous external signals while maintaining operation across a wide temperature range.

This device is appropriate for teams designing scalable, reliable embedded systems that benefit from high integration density, predictable power characteristics and RoHS compliance. Its package and resource set support long-term designs where onboard logic density and memory are key drivers of value.

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