XCKU115-L1FLVF1924I

The XCKU115-L1FLVF1924I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1924-ball FCBGA package. This industrial-grade FPGA delivers high logic capacity, significant embedded memory, and a large I/O count for demanding programmable-logic implementations in industrial systems.

Designed for surface-mount assembly and operation across a wide temperature range, the device targets applications that require high-density programmable logic, extensive I/O connectivity, and robust thermal performance.

Key Features

• Core Logic Approximately 82,920 logic elements and 1,451,100 logic cells provide substantial programmable logic resources for complex designs.
• Embedded Memory Approximately 77.7 Mbits of on-chip RAM to support buffering, packet storage, and intermediate data processing without external memory.
• I/O Capacity 728 device I/Os enable wide parallel interfacing and flexible system-level connectivity for multi-channel or multi-protocol designs.
• Power Supply Range Core voltage range of 880 mV to 979 mV to match common FPGA power delivery designs and regulators.
• Package and Mounting 1924-BBGA / 1924-FCBGA (45×45) package in a surface-mount form factor for high-pin-count, compact board implementations.
• Operating Temperature Rated for -40°C to 100°C operation to meet industrial temperature requirements.
• Compliance RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Industrial Control and Automation — Uses the device’s industrial temperature range and high I/O count to implement control logic, I/O aggregation, and protocol bridging in factory and process environments.
• High-Density Signal Processing — Large logic and embedded memory resources make the FPGA suitable for on-chip data buffering and parallel signal-processing pipelines.
• Communications and Networking — The combination of substantial logic, embedded RAM, and many I/Os supports protocol handling, packet buffering, and interface multiplexing in network equipment.

Unique Advantages

• High Logic Capacity: Substantial counts of logic elements and logic cells enable large-scale, complex designs without immediate need for multiple devices.
• Significant On-Chip Memory: Approximately 77.7 Mbits of embedded RAM reduce dependence on external memory for buffering and intermediate storage.
• Extensive I/O Count: 728 I/Os simplify integration of multi-channel interfaces and mixed-signal front ends.
• Industrial Temperature Rating: Specified -40°C to 100°C operation supports deployments in harsh or temperature-variable environments.
• Compact, High-Pin-Count Package: The 1924-FCBGA (45×45) package delivers high connectivity in a surface-mount footprint suitable for dense PCB layouts.
• RoHS Compliant: Meets environmental material requirements for regulated markets and designs.

Why Choose XCKU115-L1FLVF1924I?

The XCKU115-L1FLVF1924I combines high-density programmable logic, substantial embedded memory, and a large I/O complement in an industrial-grade FPGA package. Its operating temperature range, surface-mount FCBGA packaging, and core voltage range make it suitable for system designs that require both performance and robust environmental operation.

This device is well suited for engineers and procurement teams designing scalable, high-capacity programmable logic solutions for industrial control, signal processing, and communications equipment, offering a balance of integration, connectivity, and on-chip resources.

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