XCKU115-3FLVB1760E

The XCKU115-3FLVB1760E is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD provided in a 1760-ball FCBGA package. It delivers high programmable logic capacity, abundant on-chip memory and a large I/O count for complex, configurable digital designs.

This surface-mount, extended-grade device operates from a core supply range of 0.97 V to 1.03 V and supports an ambient operating range of 0 °C to 100 °C, making it suitable for demanding board-level implementations that require significant logic, memory and connectivity resources.

Key Features

• Programmable Logic Capacity — 1,451,100 logic elements to implement large, parallel hardware architectures and custom logic functions.
• Configurable Logic Blocks — 82,920 configurable logic blocks (CLBs) for fine-grained design partitioning and resource allocation.
• Embedded Memory — Approximately 77.7 Mbits of on-chip RAM for buffering, FIFOs and memory-intensive functions without external memory dependency.
• High I/O Count — 702 I/O pins to support wide data buses, multiple interfaces and extensive peripheral connectivity.
• Package & Mounting — 1760-ball FCBGA (1760-BBGA) surface-mount package; supplier package dimension 42.5 × 42.5 mm for compact, high-density board layouts.
• Power — Core voltage supply range of 0.970 V to 1.030 V to match system power rails and enable precise power management.
• Grade & Temperature — Extended grade device rated for 0 °C to 100 °C operating temperature.
• Compliance — RoHS compliant.

Typical Applications

• High-density logic implementations — Use the large logic element count to implement complex custom datapaths, state machines and protocol engines.
• Memory-intensive designs — Leverage approximately 77.7 Mbits of embedded memory for buffering, packet storage and local data processing.
• I/O-heavy systems — The 702 available I/Os support wide parallel interfaces, multiple peripherals and multi-channel data acquisition.
• Board-level accelerators and prototypes — Surface-mount FCBGA packaging and extensive resources enable compact accelerator boards and fast hardware prototyping.

Unique Advantages

• Large, scalable logic resource: 1.45M+ logic elements provide headroom for scaling designs without immediate partitioning or external logic.
• Significant on-chip RAM: Approximately 77.7 Mbits of embedded memory reduces dependence on external DRAM for many buffering and caching tasks.
• Extensive I/O capacity: 702 I/Os simplify integration of parallel buses, multi-lane interfaces and diverse peripherals on a single device.
• Compact, board-ready package: 1760-FCBGA (42.5 × 42.5 mm) supports high-density PCB implementations while keeping system footprint manageable.
• Precision core supply window: Narrow voltage supply range (0.970–1.030 V) supports controlled power designs and efficient power distribution on the board.
• RoHS compliant and extended grade: Compliance and extended-temperature rating support a wide range of commercial and industrial-adjacent applications.

Why Choose XCKU115-3FLVB1760E?

The XCKU115-3FLVB1760E pairs a very large logic fabric and substantial embedded memory with one of the highest I/O counts available in a single FCBGA package, enabling compact, high-function designs that consolidate logic, memory and connectivity on one device. Its extended-grade rating and precise core-voltage window make it suitable for production systems that require stable electrical and thermal behavior within the specified 0 °C to 100 °C range.

This device is well suited to design teams building advanced FPGA-based accelerators, complex protocol processors, and memory-rich data handling blocks who need a highly integrated, board-mountable solution with clear, verifiable specifications.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU115-3FLVB1760E and to discuss how it fits your next design.