XCKU115-2FLVF1924E

The XCKU115-2FLVF1924E is a field programmable gate array (FPGA) from the Kintex® UltraScale™ family. It combines large programmable logic capacity and substantial embedded memory to support complex, high-density FPGA designs.

With 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory and 728 user I/Os in a 1924-FCBGA package, this device targets designs that require significant on-chip logic and memory integration while offering surface-mount packaging and extended-grade temperature capability.

Key Features

• Logic Capacity — Provides 1,451,100 logic elements distributed across 82,920 CLBs to implement large-scale programmable logic designs.
• Embedded Memory — Approximately 77.7 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage without external memory.
• I/O Count — 728 user I/Os to accommodate extensive peripheral interfacing and high pin-count system integration.
• Package & Mounting — Supplied in a 1924-BBGA FCBGA (45×45) package optimized for surface-mount assembly on densely populated PCBs.
• Power Supply Range — Core voltage supply range of 922 mV to 979 mV for compatibility with specified power domains.
• Operating Temperature & Grade — Extended-grade device rated for 0°C to 100°C operation, suitable for applications within that thermal range.
• Compliance — RoHS compliant.

Typical Applications

• High-density logic systems — Implement complex, large-scale programmable logic functions using the device’s extensive logic element count and CLBs.
• On-chip memory–intensive designs — Use the approximately 77.7 Mbits of embedded RAM for buffering, packet processing, or algorithm state storage without relying on external memory.
• High I/O integration — Integrate multiple peripherals or high-pin-count interfaces leveraging 728 available I/Os in the 1924-FCBGA package.

Unique Advantages

• Substantial logic resources: 1,451,100 logic elements and 82,920 CLBs enable large, complex implementations on a single device.
• Significant embedded memory: Approximately 77.7 Mbits of on-chip RAM reduces dependency on external memory and simplifies board-level design.
• High I/O density: 728 user I/Os support broad peripheral connectivity and complex I/O routing requirements.
• Compact, surface-mount packaging: 1924-FCBGA (45×45) package allows integration into space-constrained PCBs while maintaining high pin count.
• Extended-grade thermal range: Rated for 0°C to 100°C to match designs that operate within that environmental envelope.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XCKU115-2FLVF1924E?

The XCKU115-2FLVF1924E positions itself as a high-capacity Kintex® UltraScale™ FPGA combining extensive logic elements, large on-chip memory, and abundant I/Os in a 1924-FCBGA surface-mount package. Its specification set is suited to engineers and procurement teams working on designs that require substantial programmable logic and embedded RAM while operating within an extended-grade temperature range.

For designs that need to consolidate complex logic and memory on a single device, this FPGA offers a balance of integration and thermal rating that supports scalable, densely integrated systems.

Request a quote or submit a procurement inquiry to evaluate the XCKU115-2FLVF1924E for your next design.