XCKU115-3FLVA2104E

The XCKU115-3FLVA2104E is a Kintex® UltraScale™ FPGA IC offering a high density of programmable logic combined with substantial on-chip memory and large I/O capability. It provides 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory, and 832 I/Os in a 2104-FCBGA package.

Designed for surface-mount assembly, this extended-grade, RoHS-compliant device operates from a core voltage range of 0.970 V to 1.03 V and across an operating temperature of 0 °C to 100 °C.

Key Features

• Core Logic  1,451,100 logic elements available to implement large, complex programmable logic and custom digital architectures.
• On-chip Memory  Approximately 77.7 Mbits of embedded memory to support buffering, lookup tables, and on-chip data storage for high-density designs.
• High I/O Count  832 I/Os to support wide bus interfaces, parallel data lanes, and extensive peripheral connectivity within a single device.
• Package & Mounting  2104-FCBGA package (2104-BBGA, supplier package 2104-FCBGA, 47.5×47.5 mm) optimized for surface-mount PCB assembly and dense board integration.
• Power  Core supply range of 0.970 V to 1.03 V to match platform power delivery requirements and enable predictable core operation.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployments requiring this thermal envelope.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Implement large-scale custom logic functions and parallel processing pipelines using the device's 1.45M logic elements and substantial embedded memory.
• I/O-intensive systems  Aggregate wide buses, interface to numerous peripherals, or handle multi-lane data streams leveraging 832 I/Os in a single package.
• Platform and prototype development  Use the device for advanced prototyping and platform development that require large logic capacity and on-chip memory.

Unique Advantages

• Very high logic density: 1,451,100 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Large embedded memory: Approximately 77.7 Mbits of on-chip RAM supports data buffering and algorithm state without immediate external memory dependence.
• Extensive I/O availability: 832 I/Os provide flexibility to connect multiple interfaces or wide parallel buses directly to the FPGA.
• Compact, manufacturable package: 2104-FCBGA (47.5×47.5 mm) supports surface-mount assembly for high-density PCB designs.
• Predictable power envelope: Defined core voltage range (0.970 V–1.03 V) helps align power delivery design and validation with device requirements.
• Compliance and extended grade: RoHS compliance and extended-grade qualification for designs operating within 0 °C–100 °C.

Why Choose XCKU115-3FLVA2104E?

The XCKU115-3FLVA2104E positions itself as a high-capacity programmable logic solution for designs that need significant on-chip resources and broad I/O support. Its combination of 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory, and 832 I/Os enables consolidation of complex digital subsystems into a single FPGA package.

This device is suited to engineering teams and procurement groups targeting scalable, high-density FPGA implementations with defined power and thermal envelopes. Its surface-mount 2104-FCBGA package and RoHS compliance support production-ready integration into advanced PCBs.

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