XCKU115-2FLVD1924I

The XCKU115-2FLVD1924I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) offered in a 1924-BBGA FCBGA package. It provides a large programmable fabric, substantial embedded memory, and a high I/O count for demanding digital designs.

Designed for industrial applications, this surface-mount FPGA supports operation from 922 mV to 979 mV and an operating temperature range of -40 °C to 100 °C, enabling deployment where wide temperature tolerance and compact, high-density integration are required.

Key Features

• Core capacity  1,451,100 logic elements for implementing large-scale custom logic and complex digital functions.
• Embedded memory  Approximately 77.7 Mbits of embedded memory (77,721,600 bits) to support buffering, lookup tables, and on-chip data storage.
• I/O connectivity  832 I/O pins to support high-channel-count interfaces and parallel connectivity on a single device.
• Package and mounting  1924-BBGA, FCBGA package (supplier device package: 1924-FCBGA, 45×45) with surface-mount mounting type for high-density PCB implementations.
• Power  Voltage supply range from 922 mV to 979 mV to match low-voltage system requirements.
• Environmental and grade  Industrial grade device with an operating temperature range of -40 °C to 100 °C and RoHS compliance.

Typical Applications

• Industrial control systems  Large logic capacity and industrial temperature rating make this FPGA suitable for complex control, sequencing, and automation tasks.
• High-density I/O aggregation  With 832 I/O pins, the device supports systems that require many parallel interfaces or signal channels on a single IC.
• Custom digital signal processing  Substantial embedded memory and extensive logic elements enable implementation of bespoke processing pipelines and buffering on-chip.
• Compact system integration  The 1924-FCBGA package offers high pin count in a compact footprint for space-constrained, high-functionality designs.

Unique Advantages

• Large programmable fabric: 1,451,100 logic elements provide headroom for complex, multi-function designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded memory reduces external memory dependency for many applications.
• Extensive I/O capability: 832 I/O pins support high channel counts and dense interface requirements on a single FPGA.
• Industrial temperature range: Rated for -40 °C to 100 °C and specified as industrial grade for deployment in wide-temperature environments.
• Compact, high-pin-count package: 1924-FCBGA (45×45) enables high-density board layouts while providing large I/O and routing options.
• Low-voltage operation: Core voltage range of 922 mV to 979 mV for integration with modern low-voltage power domains.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory considerations.

Why Choose XCKU115-2FLVD1924I?

The XCKU115-2FLVD1924I positions itself for designs that require a combination of large logic capacity, significant on-chip memory, and a high number of I/O signals in an industrial-grade FPGA. Its FCBGA package and surface-mount form factor support compact, high-density system designs while the specified voltage and temperature ranges address low-voltage operation and wide environmental conditions.

This part is well suited for engineers and system designers building complex digital processing, high-channel-count interface aggregation, or industrial control solutions that benefit from on-chip integration and scalable programmable resources.

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