XCKU115-2FLVD1517I

The XCKU115-2FLVD1517I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD provided in a 1517-BBGA FCBGA package. It offers a combination of high logic capacity, substantial on-chip memory, and a broad I/O count for complex, integration-heavy designs.

With industrial-grade temperature support and a narrow core voltage supply range, this device is intended for applications that require significant programmable logic resources, abundant embedded memory, and robust I/O connectivity in a compact surface-mount package.

Key Features

• Logic Capacity  1,451,100 logic elements and 82,920 CLBs provide large-scale programmable logic resources for complex designs.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM available for buffering, state storage, and local data processing.
• I/O Resources  338 I/O pins to support a wide range of external interfaces and parallel connections.
• Package and Mounting  1517-BBGA, FCBGA (supplier device package: 1517-FCBGA (40×40)) in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range of 0.922 V to 0.979 V to guide power delivery and regulator selection.
• Temperature Range  Industrial operating temperature from −40°C to 100°C for deployment in extended-environment applications.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Implement large-scale custom logic functions using the device’s 1,451,100 logic elements and 82,920 CLBs.
• Memory-intensive processing  Use approximately 77.7 Mbits of embedded RAM for buffering, packet storage, or local working memory in dataflow designs.
• I/O-rich interface designs  Leverage 338 I/O pins to connect multiple high-pin-count peripherals or parallel interfaces on a single FPGA.
• Industrial embedded systems  Deploy in systems requiring industrial temperature support (−40°C to 100°C) and surface-mount integration.

Unique Advantages

• High logic integration: 1,451,100 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Extensive I/O: 338 I/O pins provide flexible connectivity for complex interfacing and parallel data paths.
• Compact FCBGA package: 1517-FCBGA (40×40) surface-mount package allows high-density placement while maintaining thermal and electrical routing options.
• Industrial temperature range: Rated from −40°C to 100°C to support deployment in extended-environment applications.
• Defined core power window: A core voltage range of 0.922 V to 0.979 V enables targeted power-supply design and regulation.

Why Choose XCKU115-2FLVD1517I?

The XCKU115-2FLVD1517I positions itself as a high-capacity Kintex® UltraScale™ FPGA solution that balances extensive programmable logic, substantial embedded memory, and broad I/O in a compact 1517-FCBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for designs that demand both scale and environmental robustness.

This device is well suited for engineers and teams building complex, integration-focused systems that benefit from on-chip memory, high logic density, and numerous I/O channels—providing a scalable platform for sophisticated digital implementations.

Request a quote or submit a pricing inquiry today to confirm availability, lead time, and to receive tailored purchasing information for the XCKU115-2FLVD1517I.