XCKU115-2FLVB2104I

The XCKU115-2FLVB2104I is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD designed for complex, high-density digital designs. It provides a high count of logic elements, substantial on-chip memory, and a large I/O complement in a 2104-FCBGA surface-mount package intended for industrial applications.

Key Features

• Core FPGA Architecture Kintex® UltraScale™ FPGA family architecture implemented in this device for large-scale programmable logic integration.
• Logic Capacity Approximately 1,451,100 logic elements to support complex combinational and sequential logic implementations.
• Embedded Memory Approximately 77.7 Mbits of embedded memory for buffering, LUT-based storage, and on-chip data handling.
• I/O Density 702 user I/O pins to support high-density interfacing and system-level connectivity.
• Package and Mounting 2104-FCBGA package (47.5×47.5 mm), surface-mount design suitable for compact board integration.
• Power Supply Range Core supply range of 0.922–0.979 V to match tight power-domain requirements.
• Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet industrial-environment thermal requirements.
• Regulatory Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

• High-density interface systems Use the 702 I/Os to aggregate and route numerous external interfaces in communication or data-acquisition designs.
• Large-scale logic implementations Leverage ~1.45M logic elements for complex control, processing, and signal-flow architectures.
• Memory-intensive FPGA functions Utilize ~77.7 Mbits of on-chip memory for packet buffering, frame storage, and large LUT-based structures.
• Industrial control and automation Industrial-grade temperature range and surface-mount packaging make this device suitable for industrial system controllers and automation equipment.

Unique Advantages

• High logic integration: Approximately 1,451,100 logic elements enable consolidation of multi-chip logic into a single FPGA, reducing BOM and board complexity.
• Substantial embedded memory: Approximately 77.7 Mbits of on-chip RAM supports large buffers and data-path acceleration without depending on external memory.
• Extensive I/O capacity: 702 I/Os provide flexibility for dense peripheral connectivity and multi-channel designs.
• Industrial-rated thermal range: -40 °C to 100 °C operating range addresses the thermal demands of industrial environments.
• Compact FCBGA package: The 2104-FCBGA (47.5×47.5 mm) offers high pin count in a compact form factor for space-constrained designs.
• Controlled core voltage: Narrow supply window (0.922–0.979 V) supports predictable power-domain behavior for tightly managed systems.

Why Choose XCKU115-2FLVB2104I?

The XCKU115-2FLVB2104I positions itself for designs that require high logic density, substantial on-chip memory, and a large number of I/Os in an industrial-rated FPGA package. Its combination of approximately 1.45M logic elements, ~77.7 Mbits of embedded RAM, and 702 I/Os enables consolidation of complex functions while reducing external component count.

Backed by AMD's Kintex® UltraScale™ portfolio, this device is suited to engineers and procurement teams building robust industrial systems that need scalable logic resources, high I/O counts, and a compact FCBGA footprint.

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