XCKU115-2FLVB1760E

The XCKU115-2FLVB1760E from AMD is a high-density Kintex® UltraScale™ FPGA in a 1760-FCBGA package. It delivers large programmable logic capacity and on-chip memory for complex, configurable digital designs that require substantial I/O and embedded RAM resources.

Targeted at applications that demand extensive logic fabric and memory, this surface-mount FPGA combines approximately 1,451,100 logic elements with about 77.7 Mbits of embedded memory and 702 I/O pins, while operating within a 922 mV to 979 mV supply range and an extended temperature window of 0 °C to 100 °C.

Key Features

• Logic Capacity  Provides 1,451,100 logic elements for implementing large-scale programmable logic, custom datapaths and complex control functions.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM to support buffer, cache and memory-intensive algorithms without external memory dependency.
• I/O Density  702 user I/O pins support high-pin-count interfaces and extensive peripheral connectivity on a single device.
• Power Supply  Operates from a supply range of 922 mV to 979 mV, enabling designs that require defined low-voltage core operation.
• Package & Mounting  Available in a 1760-FCBGA (42.5 × 42.5 mm) package with surface-mount assembly, offering a compact footprint for high-density PCBs.
• Temperature & Grade  Extended-grade device rated for operation from 0 °C to 100 °C, suitable for a range of commercial and industrial ambient conditions.
• Compliance  RoHS-compliant construction supporting environmental regulatory requirements.

Typical Applications

• High-density programmable logic systems  Deploy complex algorithms and large FPGA designs that require over one million logic elements for implementation.
• Memory-intensive processing  Leverage approximately 77.7 Mbits of embedded RAM for buffering, packet processing or on-chip data storage.
• High I/O interface hubs  Utilize 702 I/O pins to consolidate many external interfaces and peripherals onto a single programmable device.
• Compact, board-level integration  The 1760-FCBGA package enables integration into space-constrained systems requiring surface-mount assembly.

Unique Advantages

• Large logic fabric: 1,451,100 logic elements allow implementation of sizeable custom architectures without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM reduces reliance on external memory and lowers system-level latency.
• High I/O count: 702 I/O pins simplify routing and integration of multiple high-bandwidth interfaces on a single FPGA.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) provides a high-pin-count solution in a compact form factor suitable for dense PCB layouts.
• Extended operating range: Rated 0 °C to 100 °C and RoHS-compliant, offering suitability across a wide set of commercial applications.
• Controlled low-voltage core: Operation within 922 mV to 979 mV supply range supports designs targeting defined low-voltage core rails.

Why Choose XCKU115-2FLVB1760E?

The XCKU115-2FLVB1760E positions itself as a high-capacity, memory-rich FPGA option from AMD’s Kintex® UltraScale™ family, balancing large programmable logic resources with significant on-chip RAM and extensive I/O. Its 1760-FCBGA packaging and surface-mount form factor make it suitable for space-conscious, high-density board designs.

This device is appropriate for engineers and system designers who require substantial logic and memory resources in a single FPGA, combined with a high pin-count for broad interfacing. For detailed electrical characteristics and implementation guidance, consult the manufacturer’s Kintex UltraScale™ documentation.

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