XCKU115-2FLVA2104E

The XCKU115-2FLVA2104E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It provides high on-chip logic capacity and substantial embedded memory within a 2104-FCBGA package.

With approximately 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory and 832 I/O pins, this device targets designs that require high logic density, extensive on-chip RAM and large I/O counts while operating within a 0 °C to 100 °C temperature range.

Key Features

• Core Logic Approximately 1,451,100 logic elements provide significant programmable fabric capacity for complex digital designs.
• Embedded Memory Approximately 77.7 Mbits of total on-chip RAM to support large buffers, FIFOs and memory-intensive processing.
• High I/O Count 832 available I/O pins to support dense connectivity and multi-channel interfaces.
• Power Supply Operates from a specified supply range of 922 mV to 979 mV, enabling defined power domain planning.
• Package & Mounting Supplied in a 2104-FCBGA package (47.5 × 47.5 mm) designed for surface-mount assembly and high-density board integration.
• Operating Range & Grade Extended grade device rated for operation from 0 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• High-density logic and compute Large-scale programmable logic for complex control, processing and custom acceleration tasks enabled by the device’s ~1.45M logic elements.
• Memory-intensive processing Systems requiring significant on-chip RAM for buffering, data staging or embedded processing benefit from approximately 77.7 Mbits of RAM.
• High I/O systems Multi-channel and connectivity-rich designs utilize the 832 I/O pins for extensive peripheral and interface support.

Unique Advantages

• Substantial programmable capacity: Approximately 1,451,100 logic elements allow integration of large custom logic blocks and complex state machines on a single device.
• Significant on-chip memory: Approximately 77.7 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-processing use cases.
• High connectivity: 832 I/O pins enable dense peripheral and channel support without compromising FPGA resources.
• Compact, board-ready package: 2104-FCBGA (47.5 × 47.5 mm) package supports surface-mount assembly for high-density PCB designs.
• Controlled power domain: Defined supply range (922 mV–979 mV) assists in precise power budgeting and system design.
• Extended grade operation: Rated for 0 °C to 100 °C to meet a range of temperature requirements.

Why Choose XCKU115-2FLVA2104E?

The XCKU115-2FLVA2104E combines a large logic fabric, extensive embedded memory and a high I/O complement in a 2104-FCBGA package, offering a scalable platform for complex, high-density designs. Its defined voltage supply range and extended-grade temperature rating make it suitable for systems that demand predictable electrical and thermal behavior.

This FPGA is appropriate for designers and teams building systems that require integrated logic capacity, substantial on-chip RAM and abundant external connectivity while adhering to RoHS requirements and surface-mount PCB assembly practices.

Request a quote or submit a procurement inquiry to obtain pricing, availability and lead-time information for the XCKU115-2FLVA2104E.