XCKU115-1FLVF1924C

The XCKU115-1FLVF1924C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers high logic capacity, substantial embedded memory, and a large I/O complement in a 1924-ball FCBGA package.

Built for designs that require significant programmable logic, on-chip RAM and dense external interfacing, this device targets applications where integration and high resource counts are key design drivers.

Key Features

• Architecture  Kintex® UltraScale™ FPGA core as indicated by the product family name.
• Logic Capacity  Approximately 1,451,100 logic elements to support complex, large-scale digital designs.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM for buffering, state storage and data processing functions.
• I/O Count  Up to 728 I/O pins for extensive external interfacing and multi-channel connectivity.
• Power  Specified supply voltage range of 922 mV to 979 mV for core power planning and sequencing.
• Package & Mounting  1924-ball FCBGA (supplier package: 1924-FCBGA, 45×45) in a surface-mount form factor suitable for compact, high-density boards.
• Operating Conditions  Commercial grade device with an operating temperature range of 0°C to 85°C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Large-scale FPGA logic implementations that require over one million logic elements for complex algorithms and datapaths.
• Memory-intensive designs  Applications that need substantial on-chip RAM for buffering, packet handling or local data storage.
• I/O-rich systems  Platforms requiring many external interfaces or parallel channels, leveraging the device’s 728 I/O pins.

Unique Advantages

• High logic density: The device’s ~1.45M logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 77.7 Mbits of on-chip RAM supports local data buffering and reduces dependence on external memory.
• Large I/O complement: 728 I/O pins allow flexible interfacing with multiple peripherals and high-channel-count systems.
• Compact FCBGA package: 1924-ball, 45×45 FCBGA package provides a high-pin-count solution in a compact footprint for dense PCB layouts.
• Commercial temperature grade: Rated for 0°C to 85°C operation, suitable for a wide range of standard commercial applications.
• RoHS compliant: Conforms to RoHS requirements for environmental and materials compliance.

Why Choose XCKU115-1FLVF1924C?

The XCKU115-1FLVF1924C positions itself as a high-capacity Kintex UltraScale FPGA option for designs that demand a large programmable fabric, significant on-chip memory and extensive I/O. Its combination of approximately 1,451,100 logic elements, roughly 77.7 Mbits of embedded RAM and 728 I/O pins supports consolidation of complex subsystems into a single device.

As a commercial-grade, RoHS-compliant device in a 1924-FCBGA (45×45) surface-mount package, it is suited to development and production platforms that require high integration density and reliable, verifiable operating conditions.

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