XCKU115-1FLVD1517C

The XCKU115-1FLVD1517C is a Kintex® UltraScale™ FPGA in a 1517-FCBGA (40×40) surface-mount package. It delivers very large logic capacity with approximately 1,451,100 logic elements and approximately 77.7 Mbits of embedded memory, combined with 338 user I/O pins for dense, programmable implementations.

Designed for commercial-grade applications, the device operates from 922 mV to 979 mV and across an ambient range of 0 °C to 85 °C. It is supplied in a 1517-BBGA FCBGA package and is RoHS compliant.

Key Features

• Core & logic density — Approximately 1,451,100 logic elements suitable for large-scale programmable designs.
• Embedded memory — Approximately 77.7 Mbits of on-chip RAM to support buffering, state storage, and high-throughput datapaths.
• I/O capacity — 338 dedicated user I/Os for wide parallel interfaces and complex board-level integration.
• Package & mounting — 1517-FCBGA (1517-BBGA) surface-mount package (40×40) for high-density PCB designs.
• Power rails — Supported supply range from 922 mV to 979 mV to match targeted system power architectures.
• Operating range & grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & compliance — RoHS compliant for restricted-substance requirements.

Typical Applications

• High-density programmable logic systems — Use the large logic element count and extensive embedded memory for complex, configurable digital designs.
• Data-path acceleration — Leverage the on-chip RAM and abundant I/O to implement buffering, packet processing, and custom datapaths.
• Prototyping and development platforms — Deploy the device in commercial-grade prototypes where high logic capacity and numerous I/Os are required.

Unique Advantages

• Significant logic capacity: Approximately 1.45 million logic elements enable large-scale integration without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM reduces dependence on external memory for many designs.
• High I/O count: 338 user I/Os simplify board-level interfacing to peripherals, high-speed buses, and parallel front-ends.
• Compact high-density package: 1517-FCBGA (40×40) packaging provides a balanced footprint for complex, space-constrained PCBs.
• Commercial-grade availability: 0 °C to 85 °C operating range aligns with standard commercial system requirements.
• Regulatory compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XCKU115-1FLVD1517C?

The XCKU115-1FLVD1517C positions itself as a high-capacity, commercially graded FPGA option for designs that require extensive programmable logic, significant embedded memory, and a large number of I/O signals in a compact FCBGA package. Its combination of approximately 1,451,100 logic elements, approximately 77.7 Mbits of on-chip RAM, and 338 I/Os makes it well suited to advanced digital designs, data-path implementations, and high-density prototype systems.

For teams focused on scalable, high-density FPGA implementations, this device offers a balance of integration and package density with clearly defined electrical and thermal operating limits for predictable integration into commercial systems.

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