XCKU115-1FLVB1760I

The XCKU115-1FLVB1760I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC designed to provide large-scale programmable logic and embedded memory resources in a compact FCBGA package. With over 1.45 million logic elements and approximately 77.7 Mbits of on-chip RAM, it supports complex, high-density digital implementations that require significant programmable fabric and memory.

Engineered for industrial environments, this device combines high I/O density and low-voltage operation with a -40 °C to 100 °C operating range, making it suitable for demanding embedded and industrial designs that need substantial logic, memory, and connectivity in a single component.

Key Features

• Core Logic  Approximately 1,451,100 logic elements provide extensive programmable fabric for complex custom logic and large-scale integration.
• Configurable Logic Blocks  82,920 CLBs (configurable logic resources) enable fine-grained implementation of parallel and pipelined architectures.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM support large buffering, lookup tables, and memory-intensive algorithms without heavy external memory dependency.
• I/O Density  702 user I/O pins accommodate high-channel-count interfaces and dense connectivity to peripherals and subsystems.
• Power Supply  Supported core voltage range from 0.922 V to 0.979 V for operation within defined low-voltage domains.
• Package & Mounting  1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount FCBGA/BBGA form factor for compact board-level integration.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C, suitable for extended-temperature deployments.
• Environmental Compliance  RoHS compliant, meeting common lead-free environmental requirements for electronic assemblies.

Typical Applications

• High-density digital processing  Implement large-scale custom logic and parallel processing pipelines using extensive logic elements and CLBs.
• Memory-intensive embedded designs  Use the approximately 77.7 Mbits of on-chip RAM for buffering, lookup tables, and local data storage to reduce external memory needs.
• High-channel I/O systems  Leverage 702 I/O pins for multi-channel data acquisition, aggregation, or interface-rich control systems.

Unique Advantages

• Highly integrated programmable fabric: Over 1.45 million logic elements consolidate complex functions into a single FPGA, reducing board-level component count.
• Substantial embedded memory: Approximately 77.7 Mbits of on-chip RAM enables heavy on-chip buffering and reduces dependence on external memory devices.
• High I/O capacity: 702 I/O pins provide flexibility for dense connectivity and multiple concurrent interfaces.
• Industrial temperature rating: -40 °C to 100 °C operating range supports deployment in extended-temperature industrial environments.
• Compact FCBGA package: 1760-FCBGA (42.5×42.5 mm) balance between high pin count and board space efficiency for system-level integration.
• RoHS compliant: Meets common environmental requirements for lead-free assembly processes.

Why Choose XCKU115-1FLVB1760I?

The XCKU115-1FLVB1760I positions itself as a high-capacity Kintex® UltraScale™ FPGA that combines extensive logic resources, significant on-chip memory, and high I/O density in a single industrial-grade FCBGA package. It is well suited for engineering teams and systems that require consolidated programmable logic, substantial embedded RAM, and dense external connectivity while operating across an extended temperature range.

For designs that demand scalable logic capacity, embedded memory bandwidth, and robust I/O, this device offers a balanced platform to simplify board-level architecture and reduce external component requirements, helping teams accelerate development of complex digital and embedded systems.

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