XCKU115-1FLVB1760C

The XCKU115-1FLVB1760C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-capacity programmable logic device packaged in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package and is specified for commercial operation.

Key on-chip resources include more than a million logic elements, substantial embedded RAM, and a large I/O count, making the device suitable for designs that require extensive programmable logic and high I/O density within a single-package FPGA.

Key Features

• Logic Capacity 1,451,100 logic elements providing large programmable logic resources for complex designs.
• Embedded Memory Approximately 77.7 Mbits of on-chip RAM (77,721,600 bits) for data buffering, state storage, and algorithm implementation.
• I/O Density 702 user I/O pins to support extensive connectivity and interfacing within system designs.
• Power Supply Core supply range specified at 922 mV to 979 mV for the device core domain.
• Package & Mounting 1760-FCBGA (1760-BBGA) package, 42.5 × 42.5 mm, designed for surface-mount assembly.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance RoHS compliant.
• Manufacturer AMD.

Unique Advantages

• High-density programmable logic: 1,451,100 logic elements provide the capacity to implement large, complex digital designs on a single device.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path requirements.
• Extensive I/O capability: 702 I/O pins enable broad system interfacing without additional I/O expanders.
• Compact FCBGA form factor: 1760-FCBGA (42.5 × 42.5 mm) delivers high integration density in a surface-mount package.
• Predictable core supply range: Specified 922 mV to 979 mV core voltage range supports defined power delivery planning.
• Commercial temperature rating: 0 °C to 85 °C operation for standard commercial applications.

Why Choose XCKU115-1FLVB1760C?

The XCKU115-1FLVB1760C positions itself as a high-capacity Kintex® UltraScale™ FPGA that combines a large logic element count, considerable embedded memory, and a high number of I/Os in a single 1760-FCBGA package. These characteristics make it suitable for designs that demand significant programmable logic resources and dense connectivity within a commercial temperature envelope.

Designed and supplied by AMD and RoHS compliant, the device is an option for teams specifying a commercially rated, high-density FPGA with clearly defined electrical, thermal, and packaging parameters.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU115-1FLVB1760C.