XCKU115-1FLVA2104C

The XCKU115-1FLVA2104C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It provides approximately 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory, and up to 832 user I/O in a surface-mount 2104-FCBGA package (47.5×47.5 mm).

Targeted at commercial-grade electronic designs, this device operates from a supply voltage range of 922 mV to 979 mV and a specified operating temperature range of 0 °C to 85 °C, offering high logic capacity, substantial on-chip RAM, and extensive I/O connectivity in a compact BGA package.

Key Features

• Core Logic Capacity  Approximately 1,451,100 logic elements provide substantial programmable logic resources for complex system implementations.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM to support large buffering, caching, and data-path requirements without external memory for many functions.
• High I/O Count  Up to 832 user I/O pins enable extensive interfacing and multi-channel system integration.
• Power Supply  Specified supply voltage range of 922 mV to 979 mV for core operation.
• Package & Mounting  2104-FCBGA package (47.5×47.5 mm), surface-mount mounting type, offering high pin density in a compact footprint.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Implement complex programmable logic and custom datapaths leveraging approximately 1,451,100 logic elements.
• Memory-intensive FPGA functions  Use the approximately 77.7 Mbits of embedded RAM for buffering, packet processing, or local data storage tasks.
• I/O-intensive systems  Support multi-interface systems or multi-channel I/O requirements with up to 832 available I/O pins.
• Compact system integration  Deploy in space-constrained designs that benefit from the high pin count of a 2104-FCBGA surface-mount package.

Unique Advantages

• Highly integrated programmable logic: The device’s approximately 1,451,100 logic elements enable large-scale custom logic and parallel processing within a single FPGA.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM reduces dependence on external memory for many data-intensive functions, simplifying BOM and board design.
• Extensive connectivity: Up to 832 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or high-bandwidth I/O channels.
• Compact high-density package: The 2104-FCBGA (47.5×47.5 mm) package delivers a high pin-count surface-mount solution for integration into modern PCBs.
• Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for a wide range of commercial applications.
• RoHS compliant: Meets RoHS environmental requirements for lead-free assembly and regulatory conformity.

Why Choose XCKU115-1FLVA2104C?

The XCKU115-1FLVA2104C combines large programmable logic capacity, significant on-chip RAM, and a high I/O count in a compact 2104-FCBGA surface-mount package, making it well suited for commercial designs that require dense logic, substantial local memory, and broad interfacing. As a member of the Kintex® UltraScale™ family from AMD, it provides a high-capacity FPGA option for systems-level integration where logic resources and I/O density are primary design drivers.

For teams designing complex programmable systems, this device provides scalability in logic and memory resources while delivering a RoHS-compliant, commercially graded option in a high-density package.

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