XCKU095-2FFVC1517E

The XCKU095-2FFVC1517E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides a high logic density device with substantial on-chip memory and a broad set of I/O resources for demanding programmable logic designs.

Designed for surface-mount deployment in a 1517-FCBGA (40×40) package and offered in Extended grade, this device targets applications that require large numbers of logic elements, abundant embedded RAM, and a significant I/O count while operating within a defined supply and temperature range.

Key Features

• Logic Capacity — 1,176,000 logic elements to support large, complex digital designs and extensive programmable logic integration.
• Embedded Memory — Approximately 60.5 Mbits of on-chip RAM for buffering, data storage, and high-speed local memory requirements.
• I/O Resources — 468 user I/O pins to interface with multiple peripherals, sensors, and high-pin-count board designs.
• Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) supplier package in a surface-mount form factor suited to compact board layouts.
• Power Supply Range — Supported core voltage supply range from 922 mV to 979 mV, enabling precise power budgeting during system design.
• Temperature & Grade — Extended grade device rated for operation from 0 °C to 100 °C, suitable for controlled-environment applications.
• Compliance — RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High-density logic systems — Use the large logic element count to implement complex state machines, signal processing pipelines, and protocol engines on a single device.
• On-chip buffering and memory-intensive designs — Approximately 60.5 Mbits of embedded memory supports large frame buffers, FIFOs, and scratchpad storage for dataflow applications.
• Multi-interface boards — 468 I/Os enable integration with multiple peripherals, expansion connectors, and mixed-signal front ends in system designs.
• Compact, high-pin-count assemblies — The 1517-FCBGA package and surface-mount mounting allow dense PCB layouts where board space and I/O density are priorities.

Unique Advantages

• Large logic resource pool: 1,176,000 logic elements reduce the need for multiple devices, simplifying BOM and board-level integration.
• Significant embedded memory: Approximately 60.5 Mbits of on-chip RAM minimizes reliance on external memory for many buffering and caching tasks.
• High I/O count: 468 I/Os offer flexibility for complex interconnects and parallel interfaces without additional multiplexing hardware.
• Compact packaging: 1517-FCBGA (40×40) enables high pin density in a surface-mount form factor, supporting compact system designs.
• predictable power window: Defined supply range (922 mV–979 mV) helps with accurate power-supply design and margin planning.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose XCKU095-2FFVC1517E?

The XCKU095-2FFVC1517E positions itself as a high-capacity FPGA option within the Kintex UltraScale family, combining over a million logic elements with substantial embedded RAM and hundreds of I/Os in a production-ready FCBGA package. Its Extended grade and defined operating and supply ranges make it suitable for designs where high integration and predictable operating conditions are required.

This device is well suited to engineering teams building large-scale programmable systems that benefit from consolidated logic, on-chip memory, and high I/O density, offering long-term design scalability and a straightforward integration path into compact, surface-mount assemblies.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU095-2FFVC1517E and to discuss how it can fit your next programmable logic design.