XCKU115-1FLVA1517I

The XCKU115-1FLVA1517I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) provided in a 1517-ball FCBGA package for surface-mount assembly. It delivers high digital logic capacity, substantial on-chip memory, and a high I/O count for demanding industrial-class programmable-logic applications.

With 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory and 624 I/Os, this device is suited to designs that require dense programmable logic, significant buffering/storage on chip, and broad external connectivity while operating across a wide industrial temperature range.

Key Features

• Logic Capacity  1,451,100 logic elements to implement large-scale programmable logic, custom compute blocks, and complex state machines.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM for data buffering, LUT-based storage, and packet/flow buffering without relying on external memory for many functions.
• I/O Resources  624 user I/Os to support extensive peripheral interfacing, multiple high-pin-count connectors, and mixed-signal front-end integrations.
• Power Supply Range  Core voltage supply specified from 922 mV to 979 mV to align with system power-rail design and power sequencing requirements.
• Package and Mounting  1517-BBGA (1517-FCBGA, 40×40) package in a surface-mount form factor for high-density board designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial operating environments.
• RoHS Compliant  Manufactured in compliance with RoHS environmental standards.

Typical Applications

• Industrial Automation  Use for programmable logic, control sequencing, and real-time interfacing where industrial temperature capability and numerous I/Os are required.
• High-Density Signal Processing  Leverage the large logic resource pool and embedded RAM for compute-heavy signal processing pipelines and FPGA-accelerated algorithms.
• Communications Equipment  Implement protocol processing, packet buffering, and multiport interfacing using the abundant logic, memory, and I/O resources.

Unique Advantages

• High Logic Integration: 1,451,100 logic elements enable consolidation of multiple functions and reduce system-level component count.
• Substantial On-Chip Memory: Approximately 77.7 Mbits of embedded RAM minimizes the need for external memory in many designs, simplifying board layout.
• Extensive I/O Count: 624 I/Os provide flexibility for parallel interfaces, multi-lane connectors, and broad peripheral support without additional I/O expanders.
• Industrial-Grade Operation: Rated from −40 °C to 100 °C for reliable use in industrial environments and temperature-variable installations.
• Compact FCBGA Package: The 1517-FCBGA (40×40) footprint allows high-density assembly while supporting the device’s large resource set.
• Controlled Core Voltage Range: A defined supply range of 922 mV to 979 mV supports predictable power design and sequencing.

Why Choose XCKU115-1FLVA1517I?

The XCKU115-1FLVA1517I positions a high-logic-capacity Kintex® UltraScale™ FPGA in a compact FCBGA package targeted at industrial-class applications. Its combination of more than 1.4 million logic elements, roughly 77.7 Mbits of embedded memory, and 624 I/Os provides the integration density needed to consolidate complex functions on a single device.

This device is suitable for engineering teams developing large-scale programmable logic solutions where on-chip memory, high I/O count, and industrial temperature capability are key selection criteria. Its package and mounting style support dense PCB implementations while meeting RoHS requirements.

Request a quote or submit an inquiry today to obtain pricing and availability for the XCKU115-1FLVA1517I.