XCKU115-1FLVB2104C

The XCKU115-1FLVB2104C is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD, supplied in a 2104-ball FCBGA package. It delivers very large programmable logic capacity and substantial on-chip memory for complex digital systems that require high logic density and extensive embedded RAM.

Designed for surface-mount assembly and RoHS-compliant production, this commercial-grade device provides a wide I/O count and operates over a commercial temperature range with a low core voltage supply for power-sensitive designs.

Key Features

• Logic Capacity — Approximately 1,451,100 logic elements to implement large-scale digital designs and complex state machines.
• Embedded Memory — Approximately 77.7 Mbits of on-chip RAM for buffering, large lookup tables, and data storage within the fabric.
• I/O Density — 702 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
• Package — 2104-FCBGA package (47.5 × 47.5 mm) in a 2104-BBGA footprint, suitable for high-density board layouts; surface-mount mounting.
• Power — Core voltage supply specified from 0.922 V to 0.979 V to match low-voltage system power domains.
• Temperature and Grade — Commercial grade operation from 0 °C to 85 °C for typical commercial electronics environments.
• Standards — RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• High-density logic implementations — Large-scale programmable logic for designs that demand extensive LUTs and complex control logic.
• Memory-intensive processing — On-chip RAM supports buffering, packet storage and intermediate data handling within the FPGA fabric.
• High-pin-count interface systems — Devices requiring hundreds of I/O lines for parallel interfaces, multi-channel data acquisition, or dense peripheral connectivity.

Unique Advantages

• Substantial logic resources — Very large logic element count enables consolidation of multiple functions into a single device, reducing system BOM and board area.
• Significant embedded RAM — Nearly 78 Mbits of on-chip memory reduces reliance on external memory and improves data throughput for latency-sensitive operations.
• High I/O capacity — 702 I/O pins accommodate complex interface requirements and simplify routing of multiple channels.
• Compact FCBGA package — 2104-ball FCBGA with a 47.5 × 47.5 mm footprint supports high-density PCB designs while providing robust interconnect.
• Low core-voltage operation — Specified 0.922–0.979 V core supply aligns with modern low-voltage system power rails for efficient power integration.
• Commercial readiness — Commercial temperature grade and RoHS compliance facilitate integration into mainstream electronic products and manufacturing flows.

Why Choose XCKU115-1FLVB2104C?

The XCKU115-1FLVB2104C positions itself as a high-capacity, commercially graded FPGA for designs that demand extensive programmable logic, abundant embedded memory, and high I/O density. Its FCBGA footprint and surface-mount form factor make it suitable for dense system boards where integrating multiple subsystems into a single programmable device reduces complexity.

This part is appropriate for engineers and procurement teams targeting scalable, high-density digital implementations that benefit from significant on-chip resources and standard commercial temperature operation, backed by AMD’s Kintex UltraScale architecture lineage.

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