XCKU115-1FLVD1517I

The XCKU115-1FLVD1517I is an industrial‑grade Kintex® UltraScale™ FPGA optimized for designs that require very high logic density and substantial on‑chip memory. It combines a large array of logic resources with a high I/O count and a compact 1517‑FCBGA package suitable for surface‑mount assembly.

Key advantages include approximately 1,451,100 logic cells, roughly 77.7 Mbits of embedded RAM, and an operating temperature range from –40 °C to 100 °C, making the device suitable for demanding industrial applications that need high integration and proven temperature robustness.

Key Features

• Core & logic capacity — Approximately 1,451,100 logic cells and 82,920 logic blocks (CLBs) provide very high programmable logic density for complex algorithms and large FPGA designs.
• Embedded memory — Approximately 77.7 Mbits of on‑chip RAM to support large buffering, lookup tables, and dataflow architectures without immediate external memory dependence.
• I/O resources — 338 user I/O pins to support wide peripheral connectivity, parallel interfaces, and multi‑lane signaling architectures.
• Power supply range — Specified supply operation from 922 mV to 979 mV, enabling designs that target this low‑voltage domain.
• Package & mounting — 1517‑BBGA (1517‑FCBGA, 40×40) surface‑mount package for high‑density board integration and thermal performance.
• Industrial grade temperature — Guaranteed operation from −40 °C to 100 °C for reliable deployment in temperature‑challenging environments.
• Regulatory status — RoHS compliant to support lead‑free manufacturing flows.

Typical Applications

• High‑density FPGA compute — Designs requiring extensive programmable logic and on‑chip memory can leverage the device’s large logic cell count and ~77.7 Mbits of embedded RAM.
• Industrial control and automation — Industrial‑grade temperature range and a high I/O count make this FPGA suitable for system controllers, motor control interfaces, and factory automation modules.
• Data handling and buffering — The substantial embedded RAM supports large buffering and packet processing functions in systems that need local data storage.

Unique Advantages

• Massive logic integration: Over 1.45 million logic cells enable consolidation of complex functions into a single device, reducing board‑level component count.
• Significant on‑chip memory: Approximately 77.7 Mbits of embedded RAM helps minimize external memory requirements and improves data throughput.
• High I/O flexibility: 338 I/Os allow direct interfacing with a wide range of sensors, transceivers, and peripherals without extensive external bridging.
• Industrial temperature support: Rated −40 °C to 100 °C for deployment in harsh or temperature‑variable environments.
• Compact FCBGA package: The 1517‑FCBGA (40×40) package delivers high integration density for space‑constrained boards while supporting surface‑mount assembly.
• RoHS compliant: Ready for lead‑free production processes and environmentally conscious manufacturing requirements.

Why Choose XCKU115-1FLVD1517I?

The XCKU115-1FLVD1517I positions itself as a high‑capacity Kintex® UltraScale™ FPGA that balances extreme logic density, extensive embedded memory, and a large I/O complement in a compact surface‑mount FCBGA package. Its industrial temperature rating and RoHS compliance make it a viable option for long‑life, robust designs that demand high integration and on‑chip resources.

This device is well suited for engineering teams building advanced, compute‑intensive systems that prefer to consolidate logic and memory on a single FPGA to simplify board design, reduce BOM complexity, and maintain thermal and mechanical consistency in industrial environments.

Request a quote or submit an inquiry to check pricing, lead times, and availability for the XCKU115-1FLVD1517I. Our team can provide ordering information and support for your procurement and design planning needs.