XCKU115-1FLVB2104I

The XCKU115-1FLVB2104I is a Field Programmable Gate Array (FPGA) IC from AMD’s Kintex® UltraScale™ family, supplied in a 2104-FCBGA package. It delivers a large programmable fabric and high I/O density suitable for industrial designs that require extensive on-chip logic, embedded memory, and robust temperature operation.

Key Features

• Programmable Logic 1,451,100 logic elements for implementing complex custom logic and parallel data processing.
• Embedded Memory Approximately 77.7 Mbits of embedded memory to support on-chip buffering, state storage, and fast local data access.
• I/O Density 702 user I/O pins to support numerous interfaces, sensor arrays, or high-channel-count designs.
• Power Supply Operates from a core voltage range of 922 mV to 979 mV, enabling predictable integration with regulated power rails.
• Package and Mounting 2104-FCBGA supplier package (47.5 × 47.5 mm) in a 2104-BBGA/FCBGA format, designed for surface-mount PCB assembly.
• Industrial Temperature Grade Specified for operation from –40 °C to 100 °C, suitable for industrial environments and extended-temperature applications.
• Compliance RoHS compliant to meet environmental and manufacturing standards.

Typical Applications

• Industrial Control & Automation — Use as a programmable logic hub for motor control, PLC offload, and distributed I/O aggregation where extended temperature range matters.
• Data Acquisition & Processing — Implement high-channel-count signal conditioning, aggregation, and real-time preprocessing using abundant logic and on-chip memory.
• Custom Protocol Bridging — Create tailor-made interface bridges and protocol converters leveraging the device’s large logic capacity and high I/O count.

Unique Advantages

• High Logic Capacity: 1,451,100 logic elements enable dense logic implementations and complex algorithm acceleration on-chip.
• Substantial On-Chip Memory: Approximately 77.7 Mbits of embedded RAM reduce reliance on external memory for many buffering and state-storage needs.
• Extensive I/O Count: 702 I/O pins simplify integration with multiple peripherals, sensors, and high-channel-count interfaces without complex multiplexing.
• Industrial-Grade Operation: Specified –40 °C to 100 °C operation supports deployment in industrial and extended-temperature environments.
• Space-Optimized Package: 2104-FCBGA (47.5 × 47.5 mm) surface-mount package consolidates high functionality in a single component footprint.
• Environmental Compliance: RoHS compliance aligns with common manufacturing and regulatory requirements.

Why Choose XCKU115-1FLVB2104I?

The XCKU115-1FLVB2104I combines a very large logic fabric, significant embedded memory, and a high I/O count in a single industrial-grade FCBGA package. Its electrical and thermal specifications make it a practical choice for engineering teams building demanding, configurable digital systems that must operate across extended temperature ranges.

This device is well suited to designers and system integrators who need on-chip capacity to consolidate functions, reduce board-level complexity, and maintain compatibility with industrial operating conditions while keeping assembly streamlined through a surface-mount FCBGA package.

Request a quote or submit a pricing inquiry to evaluate XCKU115-1FLVB2104I for your next design and to receive lead-time and availability information.