XCKU115-1FLVD1924C

The XCKU115-1FLVD1924C is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD designed for high-density logic and memory integration. With 1,451,100 logic elements and approximately 77.7 Mbits of embedded memory, the device targets designs that require substantial on-chip logic capacity, large embedded RAM, and a high I/O count.

Packaged in a 1924-ball FCBGA (45×45) and rated for commercial temperature operation, this surface-mount FPGA provides a balance of integration and connectivity for complex digital systems.

Key Features

• Logic Capacity  1,451,100 logic elements and 82,920 configurable logic blocks (CLBs) provide extensive on-chip programmable logic for complex designs.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM supports large data buffers and state storage without external memory.
• I/O Density  832 I/O pins enable broad peripheral interfacing and high signal-count connectivity for multi-channel systems.
• Package  1924-BBGA (supplier package: 1924-FCBGA, 45×45) surface-mount package suitable for compact, high-density PCB layouts.
• Supply Voltage  Operates from 922 mV to 979 mV, providing clear operating-voltage specification for power-supply design.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory  RoHS compliant to support environmentally conscious product builds.

Typical Applications

• High-density digital systems  Use the large logic capacity and CLB count to implement complex datapaths, state machines, and custom logic accelerators.
• On-chip buffering and memory-intensive functions  Leverage approximately 77.7 Mbits of embedded RAM for packet buffers, FIFOs, and localized data storage.
• Multi-channel I/O systems  The 832 I/O pins enable integration with many peripherals, sensors, and high-channel-count interfaces.

Unique Advantages

• High programmable logic density: 1,451,100 logic elements and 82,920 CLBs reduce the need for multiple devices and simplify system partitioning.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM lowers external memory dependencies and improves data throughput.
• Extensive I/O capability: 832 I/O pins support complex interfacing and reduce the need for additional I/O expanders.
• Compact package: 1924-FCBGA (45×45) offers a high-density form factor for space-constrained boards.
• Clear power and thermal specs: Defined supply voltage range (922 mV–979 mV) and commercial temperature rating (0 °C–85 °C) simplify system-level design decisions.
• RoHS compliant: Supports environmentally constrained manufacturing and product compliance goals.

Why Choose XCKU115-1FLVD1924C?

The XCKU115-1FLVD1924C positions itself as a high-capacity, commercially graded FPGA offering extensive logic, memory, and I/O resources in a compact FCBGA package. It is well suited for designs that demand large on-chip resources and dense connectivity while operating within a commercial temperature range.

Backed by AMD as the manufacturer, this Kintex® UltraScale™ device provides the raw hardware capacity required for scaling complex digital designs and consolidating system functions onto a single programmable device.

Request a quote or submit a purchase inquiry to evaluate the XCKU115-1FLVD1924C for your next high-density FPGA design project.