XCKU115-2FLVA1517E

The XCKU115-2FLVA1517E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) from AMD designed for applications that require large programmable logic capacity, substantial on‑chip memory, and high I/O density. This surface-mount FCBGA device integrates extensive logic and embedded RAM to support complex digital designs while operating within a low-voltage core range.

Key Features

• Core Logic 1,451,100 logic elements provide high-density programmable logic for complex combinational and sequential designs.
• Embedded Memory Approximately 77.7 Mbits of embedded RAM for buffering, packet processing, or scratchpad storage.
• I/O Density 624 I/O pins to support multiple high-pin-count interfaces and extensive external connectivity.
• Package 1517-BBGA / 1517-FCBGA supplier package (1517-FCBGA (40x40)) optimized for surface-mount board assemblies.
• Power Core supply operating range from 922 mV to 979 mV to match modern low-voltage system power rails.
• Operating Range & Grade Extended grade device rated for 0 °C to 100 °C operating temperature and RoHS compliant.

Typical Applications

• High-density digital processing — Large logic capacity and on‑chip RAM enable complex signal processing, protocol handling, and custom accelerators.
• High-pin-count interface bridging — 624 I/O pins support multi-channel I/O aggregation and interface conversion tasks.
• Memory-intensive buffering — Substantial embedded RAM is suited for frame buffering, packet queues, and intermediate data storage.

Unique Advantages

• High logic capacity: 1,451,100 logic elements allow implementation of large, multi-function designs on a single device.
• Substantial embedded memory: Approximately 77.7 Mbits of on-chip RAM reduces dependence on external memory for many buffering and caching needs.
• Extensive I/O: 624 I/O pins provide flexibility for complex interconnect and peripheral integration without immediate need for expansion devices.
• Compact FCBGA package: 1517-FCBGA packaging delivers a high-density footprint suitable for surface-mount PCB assembly.
• Low-voltage core operation: Core supply range of 922–979 mV aligns with modern low-voltage power architectures to help optimize system power design.
• Extended operating grade: Rated for 0 °C to 100 °C, supporting a broad set of commercial and industrial-adjacent environments.

Why Choose XCKU115-2FLVA1517E?

The XCKU115-2FLVA1517E positions itself as a high-capacity, highly integrated FPGA option within the Kintex UltraScale family, combining more than a million logic elements with tens of megabits of embedded RAM and a large I/O complement. It is suitable for design teams tackling complex digital logic, high-bandwidth interfacing, and memory-centric processing where consolidation onto a single programmable device reduces board-level complexity.

Backed by AMD’s Kintex UltraScale architecture, this device provides scalable logic and memory resources for advanced designs while offering practical supply voltage and temperature characteristics for a wide range of projects. Its FCBGA package and surface-mount mounting type simplify integration into space-constrained, production-oriented PCBs.

Request a quote or submit a pricing and availability inquiry to evaluate XCKU115-2FLVA1517E for your next high-density FPGA design.