XCKU115-1FLVF1924I

The XCKU115-1FLVF1924I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC in a 1924-BBGA FCBGA package. It provides a high-density programmable logic platform with substantial embedded memory and a broad I/O complement.

Targeted for industrial-grade designs, the device combines approximately 1,451,100 logic elements, approximately 77.7 Mbits of on-chip RAM, and 728 I/O to support complex, memory- and I/O-intensive applications across industrial and high-density programmable logic systems.

Key Features

• Logic Capacity — Approximately 1,451,100 logic elements to implement large-scale programmable logic functions and complex digital designs.
• Configurable Logic Blocks — 82,920 configurable logic blocks as specified for partitioning and organizing logic resources.
• Embedded Memory — Approximately 77.7 Mbits of on-chip RAM (77,721,600 total RAM bits) for buffering, FIFOs, and on-chip data storage.
• High I/O Count — 728 I/O pins provide extensive external interface options for multi-channel or mixed-signal systems.
• Power Supply Range — Operates with a core voltage supply range of 922 mV to 979 mV, matching the device’s specified power requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package & Mounting — 1924-BBGA, FCBGA package (supplier device package: 1924-FCBGA, 45×45) with surface-mount mounting for board-level integration.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature rating and high logic density enable real-time control, protocol handling, and automation tasks.
• High-density Digital Processing — Large logic element count and substantial on-chip RAM support complex signal processing, data aggregation, and custom compute pipelines.
• Interface Aggregation and I/O Expansion — 728 I/O pins facilitate multiple parallel interfaces, bridging, and custom peripheral connectivity.
• Embedded Memory-centric Designs — Approximately 77.7 Mbits of embedded memory provide local storage for buffering, packet processing, and temporary data retention.

Unique Advantages

• High logic density: Approximately 1,451,100 logic elements enable implementation of large, complex designs without external programmable logic.
• Substantial embedded memory: Approximately 77.7 Mbits of on-chip RAM reduces dependence on external memory and improves latency for data-intensive functions.
• Extensive I/O resources: 728 I/O pins simplify interfacing to multiple external devices, sensors, and high-channel-count systems.
• Industrial-grade operation: Rated from −40 °C to 100 °C and specified as industrial grade for deployments requiring extended temperature tolerance.
• Robust package and mounting: 1924-BBGA FCBGA package in a 45×45 supplier footprint with surface-mount mounting supports dense board layouts.
• Defined core supply range: Specified voltage supply of 922 mV to 979 mV provides clear power requirements for system design.

Why Choose XCKU115-1FLVF1924I?

The XCKU115-1FLVF1924I is positioned for designs that require a combination of high programmable logic density, large on-chip memory, and extensive I/O within an industrial-grade FPGA package. Its specified logic resources, memory capacity, and operating temperature range make it suitable for demanding industrial and high-density programmable logic applications.

Engineers and procurement teams can rely on the XCKU115-1FLVF1924I when their designs need significant on-chip resources and clear, verifiable specifications for logic capacity, memory, I/O, power supply range, and thermal operation.

Request a quote or submit an inquiry for pricing and availability of the XCKU115-1FLVF1924I to evaluate it for your next industrial or high-density programmable logic design.