XCKU115-1FLVD1924I

IC FPGA 832 I/O 1924FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 832 77721600 1451100 1924-BBGA, FCBGA

Quantity 565 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1924-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O832Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs82920Number of Logic Elements/Cells1451100
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits77721600

Overview of XCKU115-1FLVD1924I – Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC, 1924-FCBGA

The XCKU115-1FLVD1924I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD designed for high-density digital implementations. It combines substantial logic capacity, abundant I/O, and on-chip memory to address complex processing, control, and interfacing tasks in industrial applications.

With 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory, and 832 I/Os in a 1924-FCBGA surface-mount package, this industrial-grade device is aimed at designs that require large programmable fabric, wide connectivity, and extended operating temperature range.

Key Features

  • Logic Capacity  1,451,100 logic elements provide a large programmable fabric for complex digital logic, custom accelerators, and system integration.
  • Embedded Memory  Approximately 77.7 Mbits of on-chip RAM to support buffering, data storage, and memory-hungry compute kernels.
  • High I/O Count  832 general-purpose I/O pins enable extensive peripheral, bus, and interface connectivity without external multiplexing.
  • Power Supply Range  Operates with a supply voltage range from 922 mV to 979 mV as specified for the device core.
  • Package & Mounting  Supplied in a 1924-BBGA (1924-FCBGA, 45×45) surface-mount package suitable for high-density PCB designs.
  • Industrial Temperature Range  Rated for operation from –40 °C to 100 °C to meet the thermal needs of industrial and ruggedized environments.
  • Manufacturer  Produced by AMD, provided as a complete FPGA IC with the listed resource and packaging specifications.

Typical Applications

  • Industrial Control Systems  Use the high logic density and robust operating temperature range for programmable control, signal processing, and I/O aggregation in factory automation and process control equipment.
  • Communications & Networking  Leverage abundant I/O and on-chip memory for protocol handling, packet processing, and custom interface bridging in network infrastructure devices.
  • Test & Measurement  Apply the device’s large logic and memory resources to implement measurement engines, data acquisition pipelines, and real-time analysis functions.

Unique Advantages

  • Large Programmable Fabric:  1,451,100 logic elements enable consolidation of multiple functions into a single FPGA, reducing part count and board complexity.
  • Significant Embedded Memory:  Approximately 77.7 Mbits of on-chip RAM supports data buffering and complex algorithm implementation without immediate reliance on external memory.
  • Extensive I/O Capacity:  832 I/O pins simplify interfacing to sensors, transceivers, and peripherals, cutting down the need for additional I/O expanders.
  • Industrial Reliability:  Rated for –40 °C to 100 °C operation and supplied in a robust FCBGA package suitable for industrial deployments.
  • Compact, High-Density Package:  The 1924-FCBGA (45×45) surface-mount package supports high-pin-count designs while conserving PCB area.

Why Choose XCKU115-1FLVD1924I?

The XCKU115-1FLVD1924I positions itself as a high-capacity, industrial-grade FPGA option for engineers who need substantial logic, memory, and I/O in a single device. Its combination of 1,451,100 logic elements, approximately 77.7 Mbits of embedded RAM, and 832 I/Os makes it suitable for complex, integration-heavy designs where consolidating functions can simplify the bill of materials and board layout.

Designed for deployments that demand extended temperature operation and a high-density surface-mount package, this FPGA is targeted at teams building scalable, long-lived industrial and infrastructure systems that benefit from a large programmable resource pool.

If you would like pricing, availability, or to request a quote for XCKU115-1FLVD1924I, please submit a quote request or contact sales for further assistance.

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