XCKU115-1FLVD1924I
| Part Description |
Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 832 77721600 1451100 1924-BBGA, FCBGA |
|---|---|
| Quantity | 565 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1924-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 832 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 82920 | Number of Logic Elements/Cells | 1451100 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 77721600 |
Overview of XCKU115-1FLVD1924I – Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC, 1924-FCBGA
The XCKU115-1FLVD1924I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD designed for high-density digital implementations. It combines substantial logic capacity, abundant I/O, and on-chip memory to address complex processing, control, and interfacing tasks in industrial applications.
With 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory, and 832 I/Os in a 1924-FCBGA surface-mount package, this industrial-grade device is aimed at designs that require large programmable fabric, wide connectivity, and extended operating temperature range.
Key Features
- Logic Capacity 1,451,100 logic elements provide a large programmable fabric for complex digital logic, custom accelerators, and system integration.
- Embedded Memory Approximately 77.7 Mbits of on-chip RAM to support buffering, data storage, and memory-hungry compute kernels.
- High I/O Count 832 general-purpose I/O pins enable extensive peripheral, bus, and interface connectivity without external multiplexing.
- Power Supply Range Operates with a supply voltage range from 922 mV to 979 mV as specified for the device core.
- Package & Mounting Supplied in a 1924-BBGA (1924-FCBGA, 45×45) surface-mount package suitable for high-density PCB designs.
- Industrial Temperature Range Rated for operation from –40 °C to 100 °C to meet the thermal needs of industrial and ruggedized environments.
- Manufacturer Produced by AMD, provided as a complete FPGA IC with the listed resource and packaging specifications.
Typical Applications
- Industrial Control Systems Use the high logic density and robust operating temperature range for programmable control, signal processing, and I/O aggregation in factory automation and process control equipment.
- Communications & Networking Leverage abundant I/O and on-chip memory for protocol handling, packet processing, and custom interface bridging in network infrastructure devices.
- Test & Measurement Apply the device’s large logic and memory resources to implement measurement engines, data acquisition pipelines, and real-time analysis functions.
Unique Advantages
- Large Programmable Fabric: 1,451,100 logic elements enable consolidation of multiple functions into a single FPGA, reducing part count and board complexity.
- Significant Embedded Memory: Approximately 77.7 Mbits of on-chip RAM supports data buffering and complex algorithm implementation without immediate reliance on external memory.
- Extensive I/O Capacity: 832 I/O pins simplify interfacing to sensors, transceivers, and peripherals, cutting down the need for additional I/O expanders.
- Industrial Reliability: Rated for –40 °C to 100 °C operation and supplied in a robust FCBGA package suitable for industrial deployments.
- Compact, High-Density Package: The 1924-FCBGA (45×45) surface-mount package supports high-pin-count designs while conserving PCB area.
Why Choose XCKU115-1FLVD1924I?
The XCKU115-1FLVD1924I positions itself as a high-capacity, industrial-grade FPGA option for engineers who need substantial logic, memory, and I/O in a single device. Its combination of 1,451,100 logic elements, approximately 77.7 Mbits of embedded RAM, and 832 I/Os makes it suitable for complex, integration-heavy designs where consolidating functions can simplify the bill of materials and board layout.
Designed for deployments that demand extended temperature operation and a high-density surface-mount package, this FPGA is targeted at teams building scalable, long-lived industrial and infrastructure systems that benefit from a large programmable resource pool.
If you would like pricing, availability, or to request a quote for XCKU115-1FLVD1924I, please submit a quote request or contact sales for further assistance.

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