XCKU115-2FLVA1517I

The XCKU115-2FLVA1517I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) from AMD designed for high-density programmable logic and significant on-chip memory. It provides a combination of large logic capacity, extensive I/O, and industrial-grade operating range for systems that require substantial logic resources and robust thermal performance.

Key value lies in its high logic element count, large embedded memory capacity, and a 624-pin I/O interface, delivered in a 1517-FCBGA surface-mount package for compact board-level integration.

Key Features

• Programmable Fabric — 1,451,100 logic elements and 82,920 CLBs provide substantial capacity for complex FPGA designs.
• Embedded Memory — Total on-chip RAM of 77,721,600 bits, approximately 77.7 Mbits of embedded memory for buffering, frame storage, and working memory.
• I/O Capacity — 624 user I/O pins to support parallel interfaces, multiple lanes, or diverse peripheral connections.
• Package and Mounting — 1517-BBGA / 1517-FCBGA (40×40) surface-mount package for board-level integration in compact layouts.
• Power — Core voltage supply specified in the range of 922 mV – 979 mV for device operation.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory — RoHS compliant for environmental regulatory alignment.

Typical Applications

• High-density logic designs — Ideal for systems that require up to 1,451,100 logic elements and a large CLB fabric to implement complex digital logic and state machines.
• I/O-intensive systems — Suited to applications needing extensive external connectivity, leveraging the 624 available I/O pins.
• Memory-demanding functions — Use cases that require substantial on-chip buffering or frame storage benefit from approximately 77.7 Mbits of embedded memory.
• Industrial equipment — Components and systems that require industrial-grade operation and a –40 °C to 100 °C operating range.
• Compact board-level solutions — Applications requiring a high-pin-count, surface-mount FCBGA package for space-constrained designs.

Unique Advantages

• High logic density: 1,451,100 logic elements support large-scale programmable designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-path tasks.
• Large I/O complement: 624 I/O pins enable broad peripheral connectivity and parallel interface implementations.
• Industrial temperature capability: Rated operation from –40 °C to 100 °C supports deployment in demanding thermal environments.
• Compact FCBGA package: 1517-FCBGA (40×40) surface-mount packaging enables high pin-count integration in a space-efficient form factor.
• RoHS compliant: Meets environmental compliance requirements for regulated markets.

Why Choose XCKU115-2FLVA1517I?

The XCKU115-2FLVA1517I positions itself as a high-capacity FPGA option for designers needing substantial logic resources, significant embedded memory, and broad I/O in a compact, surface-mount package. Its industrial operating range and RoHS compliance make it suitable for applications where temperature resilience and regulatory conformance matter.

This device is well suited to engineering teams and procurement groups specifying a single-chip solution with large programmable fabric, high I/O count, and on-chip memory — delivering scalability and component-level robustness for complex FPGA-based systems.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XCKU115-2FLVA1517I.