XCKU115-2FLVB1760I

The XCKU115-2FLVB1760I is an AMD Kintex® UltraScale™ field programmable gate array provided in a 1760-ball FCBGA package. It delivers very-large-scale programmable logic with a high count of embedded memory bits and a dense I/O complement for complex digital designs.

Designed for surface-mount PCB assembly and industrial-grade operation, this device targets applications that require large amounts of logic resources, substantial on-chip RAM, and a wide operating temperature range.

Key Features

• Core Logic  Approximately 1,451,100 logic elements and 82,920 logic blocks provide extensive programmable fabric for high-density designs.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM to support large buffers, FIFOs, and data-path storage within the FPGA fabric.
• I/O Capacity  702 user I/O pins to support dense peripheral connectivity and high channel counts.
• Power  Core voltage supply range of 922 mV to 979 mV to match system power delivery requirements.
• Package & Mounting  1760-FCBGA package (42.5×42.5 mm) supplied for surface-mount assembly, enabling compact PCB integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable performance across extended environments.
• Compliance  RoHS compliant to meet environmental material-content requirements.

Typical Applications

• High-density digital processing  Large logic and memory resources enable complex signal processing, protocol handling, and data-path implementations.
• Multi-channel I/O systems  High I/O count supports aggregation and interfacing of many parallel or serial channels.
• Embedded memory buffering  Approximately 77.7 Mbits of on-chip RAM allow local buffering, packet queues, and frame storage without external memory in some designs.

Unique Advantages

• Extensive programmable capacity:  A large count of logic elements (1,451,100) and logic blocks (82,920) accommodates complex, resource-intensive designs without partitioning across multiple devices.
• Substantial on-chip memory:  Approximately 77.7 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• High I/O density:  702 I/O pins enable dense connectivity to sensors, transceivers, and peripherals, simplifying board-level routing for high-channel-count systems.
• Industrial temperature range:  Rated −40 °C to 100 °C for deployment in environments that require extended temperature performance.
• Compact, surface-mount package:  1760-FCBGA (42.5×42.5 mm) supports high-density PCB layouts while maintaining robust mounting for production assembly.
• Regulatory readiness:  RoHS compliance supports installations with environmental material restrictions.

Why Choose XCKU115-2FLVB1760I?

The XCKU115-2FLVB1760I positions itself as a high-capacity Kintex® UltraScale™ FPGA option for designs that demand significant programmable logic, on-chip memory, and dense I/O in a single industrial-grade package. Its combination of 1,451,100 logic elements, approximately 77.7 Mbits of embedded RAM, and 702 I/Os supports scalable, high-performance architectures while simplifying board-level integration with a 1760-FCBGA surface-mount package.

This device suits teams and projects that need long-term scalability and robustness in challenging temperature environments, offering a clear specification set for system architects and procurement to evaluate against design requirements.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU115-2FLVB1760I.