XCKU115-2FLVB2104E

The XCKU115-2FLVB2104E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It provides a high logic capacity FPGA fabric combined with substantial on-chip memory and broad I/O in a 2104-FCBGA package.

Key measurable attributes include 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory, 702 I/O pins, an operating temperature range of 0 °C to 100 °C, and a nominal voltage supply range of 922 mV to 979 mV. The device is offered in an extended grade and is surface-mount packaged.

Key Features

• Core Logic 1,451,100 logic elements to support high-density programmable logic implementations.
• Embedded Memory Approximately 77.7 Mbits of on-chip RAM to support buffering, on-chip data storage, and memory-intensive functions.
• I/O Capacity 702 I/O pins providing extensive external connectivity for multi-channel interfaces and system-level integration.
• Power Voltage supply range of 922 mV to 979 mV to define power delivery planning.
• Package 2104-FCBGA (47.5×47.5 mm) / 2104-BBGA surface-mount package for high-density board integration.
• Operating Range & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.

Unique Advantages

• High logic capacity: 1,451,100 logic elements enable consolidation of complex logic and large-scale designs into a single device.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM reduce dependence on external memory for data buffering and local storage.
• Extensive I/O: 702 I/O pins allow flexible connectivity and support for multiple external interfaces or parallel channels.
• Dense package option: 2104-FCBGA (47.5×47.5 mm) provides a high-pin-count, compact footprint for space-constrained board layouts.
• Defined power envelope: 922–979 mV supply range enables precise power-supply design and thermal planning.
• Extended operating range: 0 °C to 100 °C support for a wide set of deployment conditions within the extended grade specification.

Why Choose XCKU115-2FLVB2104E?

The XCKU115-2FLVB2104E combines high logic density, significant embedded memory, and broad I/O in a single AMD Kintex® UltraScale™ FPGA package. Its measurable resources and package characteristics make it suitable for designs that require large programmable logic capacity and substantial on-chip memory while maintaining a compact, high-pin-count footprint.

Offered in extended grade with a clearly defined supply and temperature range, this device provides a quantifiable platform for engineers and procurement teams seeking scalability and predictable system integration for high-density FPGA implementations.

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