XCKU115-2FLVD1517E
| Part Description |
Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 338 77721600 1451100 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,724 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 338 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 82920 | Number of Logic Elements/Cells | 1451100 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 77721600 |
Overview of XCKU115-2FLVD1517E – Kintex® UltraScale™ Field Programmable Gate Array (FPGA)
The XCKU115-2FLVD1517E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides high-density programmable logic and embedded memory in a surface-mount FCBGA package.
With 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory and 338 I/O, this device targets designs that require large logic capacity, substantial on-chip RAM and a high pin-count interconnect in a 1517-BBGA (1517‑FCBGA, 40×40) package.
Key Features
- Core Logic: 1,451,100 logic elements provide high-density programmable logic resources for complex digital designs.
- Embedded Memory: Approximately 77.7 Mbits of on-chip RAM for buffering, lookup tables and data storage without external memory dependency.
- I/O Capacity: 338 I/Os to support broad interfacing requirements and high-pin-count systems integration.
- Package and Mounting: 1517-BBGA / 1517-FCBGA (40×40) package in a surface-mount format for compact board-level integration.
- Power Supply Range: Operates from 922 mV to 979 mV supply range as specified for core operation.
- Temperature and Grade: Extended grade with an operating temperature range of 0 °C to 100 °C to match temperature-controlled application environments.
- Compliance: RoHS compliant to meet standard lead-free manufacturing requirements.
Unique Advantages
- High logic density: Over one million logic elements enable implementation of complex algorithms and large-scale digital systems on a single device.
- Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM reduces dependency on external memory, simplifying BOM and board layout.
- Extensive I/O count: 338 I/Os provide flexibility for multi-channel interfaces, sensor arrays, and high-speed connectivity options.
- Compact FCBGA packaging: 1517-FCBGA (40×40) package supports high-density PCB designs while maintaining surface-mount assembly compatibility.
- Extended operating range: Rated for 0 °C to 100 °C operation and extended-grade qualification for applications inside that temperature window.
- Regulatory readiness: RoHS compliance enables use in lead-free manufacturing processes.
Why Choose XCKU115-2FLVD1517E?
The XCKU115-2FLVD1517E provides a combination of very high logic capacity, significant embedded memory and a large I/O count in a compact FCBGA surface-mount package. Its electrical and thermal specifications make it suitable for designs that require dense programmable logic and on-chip storage within the specified 0 °C to 100 °C operating range.
As an AMD Kintex® UltraScale™ device, it is positioned for engineering teams seeking high-capacity FPGA resources and a board-level, RoHS-compliant package to support complex digital systems and high-pin-count integrations.
Request a quote or submit an inquiry to check availability and pricing for the XCKU115-2FLVD1517E.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
