XCKU115-2FLVD1924E

The XCKU115-2FLVD1924E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC designed for applications that require high logic density, significant on-chip memory, and a high I/O count. Its architecture delivers extensive programmable logic resources and embedded memory capacity in a 1924‑ball FCBGA surface-mount package.

This device is targeted at designs that need large-scale programmable logic and connectivity while operating within an extended commercial temperature range and a defined core voltage window.

Key Features

• Logic Capacity  Approximately 1,451,100 logic elements suitable for large-scale programmable designs and complex logic implementation.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM available for buffering, state storage, and memory-intensive functions.
• I/O Resources  832 user I/O pins to support high‑pin-count interfaces and multi-channel connectivity.
• Package and Mounting  1924‑BBGA (1924‑FCBGA, 45×45) surface-mount package for compact board-level integration.
• Power Supply Range  Core voltage supply specified from 922 mV to 979 mV to match system power delivery requirements.
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployments within that thermal envelope.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density logic and compute  Implement large custom logic and compute pipelines using the device's ~1.45M logic elements.
• Memory‑intensive designs  Use the approximately 77.7 Mbits of embedded RAM for buffering, packet processing, or large state machines.
• High‑pin‑count interfacing  Leverage 832 I/O for multi‑channel data I/O, protocol bridging, or dense peripheral connectivity.
• Compact system integration  Integrate extensive logic and memory in a 1924‑ball FCBGA footprint for space-constrained boards.

Unique Advantages

• High logic density: Approximately 1,451,100 logic elements reduce the need to partition designs across multiple devices.
• Substantial on‑chip memory: Approximately 77.7 Mbits of embedded RAM supports larger buffers and data‑centric processing on chip.
• Large I/O complement: 832 I/O pins enable broad external connectivity without external multiplexing components.
• Compact FCBGA package: 1924‑ball FCBGA (45×45) provides a high resource count in a single, surface-mount package for streamlined PCB layouts.
• Defined power window: Core supply range of 922 mV to 979 mV clarifies power delivery requirements during system design.
• Extended operational range: Extended grade and 0 °C to 100 °C operating temperature support deployments within that thermal range.

Why Choose XCKU115-2FLVD1924E?

The XCKU115-2FLVD1924E combines very large programmable logic capacity, substantial embedded memory, and a high I/O count in a single 1924‑FBGA surface‑mount package. This balance of resources makes it suitable for system designs that demand consolidated logic, significant on‑chip storage, and broad external interfacing without spreading functionality across multiple devices.

Engineers and procurement teams seeking a high‑capacity FPGA with clearly specified power, temperature, and packaging characteristics can evaluate this Kintex® UltraScale™ device as a scalable, RoHS‑compliant option for complex programmable designs.

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