XCKU115-3FLVA1517E

The XCKU115-3FLVA1517E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) offered in a 1517-FCBGA package. It provides high on-chip logic capacity and embedded RAM suited to complex, resource-intensive programmable logic designs.

Key hardware characteristics include approximately 1,451,100 logic elements, roughly 77.7 Mbits of embedded RAM, 624 user I/O pins, an extended-grade operating range, and a low-voltage core supply range — all in a surface-mount FCBGA package.

Key Features

• Core Logic Capacity — Approximately 1,451,100 logic elements for large-scale programmable logic, enabling dense implementation of custom functions and algorithms.
• Embedded Memory — Approximately 77.7 Mbits of on-chip RAM to support data buffering, FIFOs and local storage without external memory for many functions.
• I/O Density — 624 user I/O pins to support multiple parallel interfaces and high-pin-count system integration.
• Package and Mounting — 1517-FCBGA (40 × 40) package, surface-mount construction for board-level integration in compact designs.
• Power Supply — Core voltage supply specified from 970 mV to 1.03 V for tight power-domain design and supply planning.
• Operating Temperature — Rated for operation from 0 °C to 100 °C in extended grade, suitable for environments within that temperature envelope.
• Compliance — RoHS compliant, supporting regulatory and environmental planning.

Unique Advantages

• High integration: Large logic capacity and significant on-chip RAM reduce reliance on external devices for many functions, simplifying PCB design.
• High I/O count: 624 I/O pins enable flexible connectivity for parallel buses, multi-lane interfaces, and mixed-signal breakout requirements.
• Compact, manufacturable package: 1517-FCBGA surface-mount format supports high-density board layouts while remaining compatible with standard PCB assembly flows.
• Predictable power domain: A defined core voltage window (970 mV–1.03 V) aids in power-supply design and verification for reliable operation.
• Extended-grade operation: Rated for 0 °C to 100 °C, providing operational headroom for temperature-variable environments within that range.
• Environmental compliance: RoHS compliance supports product planning for markets requiring hazardous-substance restrictions.

Why Choose XCKU115-3FLVA1517E?

The XCKU115-3FLVA1517E delivers a balance of large logic capacity, substantial embedded memory, and high I/O density in a single FCBGA package. These concrete hardware attributes make it a strong choice for designs that require significant programmable logic and on-chip data storage while maintaining a compact board footprint.

This device suits customers seeking scalable FPGA resources with clear electrical and thermal envelopes: an explicitly specified core voltage range, extended-grade temperature rating, and surface-mount 1517-FCBGA packaging. Its combination of resources and compliance characteristics supports longer-term design planning and production readiness for applicable deployment environments.

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