XCKU115-3FLVF1924E

The XCKU115-3FLVF1924E is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD, delivered in a 1924-FCBGA (45×45) surface-mount package. It combines very high logic capacity, substantial embedded RAM, and a large I/O count to support complex, high-density digital designs.

That capacity makes this device suitable for applications that require significant on-chip logic and memory resources while operating within a 0.97–1.03 V core supply range and an ambient temperature window of 0 °C to 100 °C.

Key Features

• Core Logic  Approximately 1,451,100 logic cells provide large programmable fabric for complex designs and parallel implementations.
• Configurable Logic Capacity  High logic element density supports complex state machines, datapaths and custom accelerators.
• On‑Chip Memory  Approximately 77.7 Mbits of embedded memory to store buffers, FIFOs and intermediate data close to logic.
• I/O Density  728 user I/O pins enable broad external connectivity for high-bandwidth interfaces and multi‑channel systems.
• Power  Core voltage supply specified from 0.97 V to 1.03 V for compatibility with defined power distribution designs.
• Package & Mounting  1924‑ball FCBGA (45×45) package in a surface-mount format for compact, board-level integration.
• Operating Range  Grade: Extended; temperature range: 0 °C to 100 °C for deployment in a variety of commercial environments.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High‑density signal processing  Large logic capacity and significant on‑chip RAM make the device suitable for DSP pipelines and streaming data processing tasks.
• Custom hardware acceleration  Use the programmable fabric to implement hardware accelerators for algorithmic offload and latency-sensitive computation.
• Multi‑channel I/O systems  A high I/O count supports multi‑lane interfaces, sensor aggregation, and large peripheral arrays.
• Embedded system integration  Substantial logic and memory resources allow consolidation of multiple functions into a single programmable device.

Unique Advantages

• Significant logic density: Enables complex designs and higher levels of functional integration on a single device.
• Large embedded memory: Approximately 77.7 Mbits of RAM reduces external memory dependency and improves data locality.
• Extensive I/O capability: 728 I/O pins facilitate broad external interfacing without additional bridging logic.
• Compact FCBGA package: 1924‑ball FCBGA (45×45) allows high pin count in a space-efficient form factor for board-level integration.
• Predictable power envelope: Narrow core voltage range (0.97–1.03 V) simplifies power-supply design and margining.
• Commercial extended temperature: Operation from 0 °C to 100 °C supports a wide range of commercial and enterprise deployments.

Why Choose XCKU115-3FLVF1924E?

The XCKU115-3FLVF1924E is positioned for designs that need a balance of very high logic capacity, substantial embedded RAM, and extensive I/O in a compact package. Its specifications make it well suited to consolidate multiple functions into a single FPGA, reduce BOM complexity, and support complex datapaths and acceleration engines.

Choose this device for projects that demand scalable programmable resources and robust on‑chip memory while operating within defined commercial temperature and supply constraints. Its RoHS compliance and extended grade help ensure manufacturability and lifecycle continuity for production designs.

Request a quote or submit an inquiry to check availability and pricing for the XCKU115-3FLVF1924E.