XCKU11P-1FFVA1156E
| Part Description |
Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 464 53964800 653100 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,994 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 464 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37320 | Number of Logic Elements/Cells | 653100 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53964800 |
Overview of XCKU11P-1FFVA1156E – Kintex® UltraScale+™ FPGA, 1156-FCBGA
The XCKU11P-1FFVA1156E is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD presented in a 1156‑ball FCBGA package. It combines high logic density with substantial on-chip memory and a large I/O count to address complex, programmable logic requirements.
Key device characteristics include 653,100 logic elements, approximately 54 Mbits of embedded memory, 464 I/O, surface-mount 1156‑FCBGA packaging (35×35), an extended grade operating range of 0°C to 100°C, and a nominal supply range of 825 mV to 876 mV. The device is RoHS compliant.
Key Features
- Core & Logic 653,100 logic elements provide substantial programmable logic capacity for large-scale designs.
- Embedded Memory Approximately 54 Mbits of on-chip RAM to support data buffering, frame storage, and other memory-intensive functions.
- I/O Capacity 464 I/O pins enabling extensive external interfacing and parallel connectivity.
- Power Designed to operate with a supply voltage range of 825 mV to 876 mV to match system power rails.
- Package & Mounting 1156‑FCBGA (35×35) package in a surface-mount form factor for compact board integration.
- Temperature & Grade Extended grade specified for operation from 0°C to 100°C, addressing a broad range of thermal environments.
- Compliance RoHS compliant to support lead‑free assembly requirements.
Unique Advantages
- High logic density: 653,100 logic elements allow implementation of complex, large-scale programmable functions without external glue logic.
- Substantial on-chip memory: Approximately 54 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- Extensive I/O: 464 available I/O pins provide flexibility for connecting multiple peripherals, sensors, and external interfaces.
- Compact FCBGA package: The 1156‑FCBGA (35×35) package supports dense PCB layouts while maintaining high pin count.
- Controlled power window: The 825 mV to 876 mV supply range supports tight power budgeting and integration with regulated power systems.
- Extended operating range: Rated for 0°C to 100°C to meet a variety of deployment environments where extended temperature operation is required.
Why Choose XCKU11P-1FFVA1156E?
The XCKU11P-1FFVA1156E positions itself as a high‑capacity, programmable logic device that brings together large logic element counts, significant embedded memory, and broad I/O in a compact FCBGA package. Its electrical and thermal specifications provide clear engineering parameters for system integration.
This device is suited to development teams and procurement groups seeking a RoHS‑compliant FPGA with a quantifiable combination of logic resources, on‑chip RAM, and I/O density—offering a scalable building block for complex programmable designs.
Request a quote or submit an inquiry for pricing and availability to receive detailed procurement information for the XCKU11P-1FFVA1156E.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








