XCKU11P-1FFVA1156E

IC FPGA 464 I/O 1156FCBGA
Part Description

Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 464 53964800 653100 1156-BBGA, FCBGA

Quantity 1,994 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O464Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs37320Number of Logic Elements/Cells653100
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53964800

Overview of XCKU11P-1FFVA1156E – Kintex® UltraScale+™ FPGA, 1156-FCBGA

The XCKU11P-1FFVA1156E is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD presented in a 1156‑ball FCBGA package. It combines high logic density with substantial on-chip memory and a large I/O count to address complex, programmable logic requirements.

Key device characteristics include 653,100 logic elements, approximately 54 Mbits of embedded memory, 464 I/O, surface-mount 1156‑FCBGA packaging (35×35), an extended grade operating range of 0°C to 100°C, and a nominal supply range of 825 mV to 876 mV. The device is RoHS compliant.

Key Features

  • Core & Logic 653,100 logic elements provide substantial programmable logic capacity for large-scale designs.
  • Embedded Memory Approximately 54 Mbits of on-chip RAM to support data buffering, frame storage, and other memory-intensive functions.
  • I/O Capacity 464 I/O pins enabling extensive external interfacing and parallel connectivity.
  • Power Designed to operate with a supply voltage range of 825 mV to 876 mV to match system power rails.
  • Package & Mounting 1156‑FCBGA (35×35) package in a surface-mount form factor for compact board integration.
  • Temperature & Grade Extended grade specified for operation from 0°C to 100°C, addressing a broad range of thermal environments.
  • Compliance RoHS compliant to support lead‑free assembly requirements.

Unique Advantages

  • High logic density: 653,100 logic elements allow implementation of complex, large-scale programmable functions without external glue logic.
  • Substantial on-chip memory: Approximately 54 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Extensive I/O: 464 available I/O pins provide flexibility for connecting multiple peripherals, sensors, and external interfaces.
  • Compact FCBGA package: The 1156‑FCBGA (35×35) package supports dense PCB layouts while maintaining high pin count.
  • Controlled power window: The 825 mV to 876 mV supply range supports tight power budgeting and integration with regulated power systems.
  • Extended operating range: Rated for 0°C to 100°C to meet a variety of deployment environments where extended temperature operation is required.

Why Choose XCKU11P-1FFVA1156E?

The XCKU11P-1FFVA1156E positions itself as a high‑capacity, programmable logic device that brings together large logic element counts, significant embedded memory, and broad I/O in a compact FCBGA package. Its electrical and thermal specifications provide clear engineering parameters for system integration.

This device is suited to development teams and procurement groups seeking a RoHS‑compliant FPGA with a quantifiable combination of logic resources, on‑chip RAM, and I/O density—offering a scalable building block for complex programmable designs.

Request a quote or submit an inquiry for pricing and availability to receive detailed procurement information for the XCKU11P-1FFVA1156E.

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