XCKU11P-1FFVD900I

The XCKU11P-1FFVD900I is an AMD Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) provided in a 900-FCBGA package. It delivers a high logic capacity and substantial on-chip memory in an industrial-grade FPGA targeted at systems that require dense programmable logic, large embedded memory and significant I/O connectivity.

Key device attributes include 653,100 logic elements, approximately 54 Mbits of embedded memory, 408 I/Os, a 900-BBGA (900-FCBGA) package format, low-voltage core operation from 825 mV to 876 mV, and an industrial operating temperature range of -40 °C to 100 °C.

Key Features

• Core Logic  653,100 logic elements for implementing large, complex digital designs and custom logic functions.
• Embedded Memory  Approximately 54 Mbits of on-chip RAM to support buffering, packet processing, and data-intensive logic.
• I/O Density  408 I/Os to support interfaces to external devices, sensors and high-pin-count system designs.
• Package  900-FCBGA (900-BBGA) package, supplied in the 31x31 configuration for high-density board integration.
• Power Supply  Core voltage supply specified from 825 mV to 876 mV for low-voltage operation.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet demanding thermal environments.
• RoHS Compliant  Conforms to RoHS requirements for restricted hazardous substances.

Typical Applications

• Industrial control systems  Use the device's industrial temperature rating and large logic capacity for machine control, programmable automation and process control tasks.
• High-density logic implementations  Suitable where complex custom logic and large embedded memory are required for signal processing or protocol handling.
• I/O-intensive platforms  Leverage 408 I/Os for multi-channel interfacing, sensor aggregation, and systems with diverse peripheral connections.

Unique Advantages

• Large logic resource: 653,100 logic elements enable integration of extensive custom logic and state machines on a single device, reducing system-level component count.
• Substantial on-chip memory: Approximately 54 Mbits of embedded RAM supports buffering, intermediate data storage and memory-hungry algorithms without external memory in some designs.
• High I/O capacity: 408 I/Os provide flexibility for multi-interface systems and reduce the need for additional I/O expanders.
• Industrial-grade thermal range: Rated from -40 °C to 100 °C for deployment in environments with extended temperature excursions.
• Compact, high-pin-count package: The 900-FCBGA (31x31) package balances integration density with board-level routing for complex, space-constrained systems.
• Regulatory compliance: RoHS compliance supports use in products that require restricted-substance conformity.

Why Choose XCKU11P-1FFVD900I?

The XCKU11P-1FFVD900I positions itself as a high-capacity, industrial-grade FPGA option within the Kintex® UltraScale+™ family from AMD. Its combination of 653,100 logic elements, approximately 54 Mbits of embedded memory, and 408 I/Os provides a strong foundation for designs that require dense programmable logic, significant on-chip storage and broad external connectivity.

Engineers and procurement teams seeking a scalable, robust programmable device for industrial applications will find this part suitable for integrating advanced digital functions while benefiting from the packaging, thermal range, and compliance attributes documented for this device.

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