XCKU11P-2FFVA1156E

The XCKU11P-2FFVA1156E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers a high-density programmable logic fabric with a large complement of embedded memory and I/O in a 1156-ball FCBGA package suitable for surface-mount assembly.

Key on-chip resources include 653,100 logic elements and approximately 54 Mbits of embedded RAM, along with 464 user I/O pins. The device is offered in an extended grade with an operating temperature range of 0 °C to 100 °C and RoHS-compliant materials.

Key Features

• Programmable Logic Capacity — 653,100 logic elements provide large-scale programmable resources for complex digital designs.
• Configurable Logic Blocks — 37,320 CLBs (configurable logic blocks) enable fine-grained implementation of custom logic functions.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory.
• I/O Resources — 464 I/O pins available for interfacing to peripherals, high-speed transceivers, and system-level interconnects.
• Package and Mounting — 1156-BBGA / 1156-FCBGA (35 × 35 mm) package designed for surface-mount assembly to minimize board footprint.
• Power Supply Range — Core supply range of 0.825 V to 0.876 V to match system power-rail requirements.
• Temperature and Grade — Extended-grade device rated for operation from 0 °C to 100 °C.
• Environmental Compliance — RoHS compliant materials and manufacturing.

Unique Advantages

• High integration density: 653,100 logic elements and approximately 54 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive I/O count: 464 user I/Os allow flexible interfacing options and support for multiple peripherals and buses.
• Compact FCBGA package: 1156-ball FCBGA (35 × 35 mm) provides a high pin count in a space-efficient surface-mount form factor.
• Controlled core-voltage support: Specified core supply range (0.825–0.876 V) aligns with power delivery designs that target lower-voltage FPGA cores.
• Extended-grade operation: Rated for 0 °C to 100 °C, suitable for applications requiring this specified thermal range.
• Standards-compliant materials: RoHS compliance supports environmental and regulatory requirements.

Why Choose XCKU11P-2FFVA1156E?

The XCKU11P-2FFVA1156E positions itself as a high-density, highly integrated Kintex UltraScale+ FPGA option for designs that need substantial programmable logic, on-chip memory, and abundant I/O in a compact FCBGA package. Its combination of 653,100 logic elements, approximately 54 Mbits of embedded RAM, and 464 I/Os supports complex digital systems while reducing external component count.

With extended-grade temperature rating and RoHS compliance, this device is suitable for applications and development platforms that require verified supply-voltage operation and a high degree of integration backed by AMD's Kintex UltraScale+ series pedigree.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XCKU11P-2FFVA1156E.